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FCB11N60

Onsemi

FCB11N60 by Onsemi

FCB11N60 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 33A and EAS of 340mJ, operating in ENHANCEMENT MODE at up to 150 °C. The transistor has a 0.38 ohm RDS(on) and DRAIN case connection in a RECTANGULAR package with GULL WING terminals.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

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Digiode

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LIBRA Elektronik GmbH

Germany . 50 parts In-Stock

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Prism Electronics

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LittleDiode

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A-Z Elektronik GmbH

Germany . 9,765 parts In-Stock

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TANS Electronics

Latvia . 8,163 parts In-Stock

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Problanco Electronics

Mexico . 6,069 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,010 parts In-Stock

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SupplyDigital Components

Austria . 2,314 parts In-Stock

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Kulean Microsystems

USA . 1,996 parts In-Stock

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Northwest PG Solutions

USA . 1,349 parts In-Stock

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Corphita

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Supply Digital

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UHIMA Technologies

Türkiye . 899 parts In-Stock

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Native Components

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Corohmni

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Perfect Parts

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Overview

Unleash the power of innovation with the FCB11N60 by Onsemi. Designed to deliver unparalleled performance and reliability, this Power Field Effect Transistor (FET) is a game-changer in the world of switching applications. With a robust construction and cutting-edge technology, this N-CHANNEL transistor offers customers unmatched value and benefits. Whether you're looking to optimize your power management systems or boost efficiency in your devices, the FCB11N60 is the ideal choice. Trust Onsemi's expertise and elevate your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher efficiency compared to P-channel transistors, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse voltage polarity, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient power handling capabilities.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 600 V

Provides high voltage tolerance, making it suitable for high-power applications and ensuring safe operation under various conditions.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts and allows for efficient space utilization in electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections and mechanical stability, ensuring reliable performance in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor's conductivity, enabling efficient power management and switching control.

Maximum Pulsed Drain Current (IDM): 33 A

High maximum pulsed drain current rating ensures robust performance and reliability in high-current transient conditions.

Avalanche Energy Rating (EAS): 340 mJ

High avalanche energy rating indicates the transistor's ability to withstand voltage spikes and maintain stability during overvoltage events.

No. of Terminals: 2

Simple two-terminal design simplifies circuit connections and facilitates integration into various electronic systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact designs, suitable for applications with limited board real estate.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low power consumption, high efficiency, and fast switching speeds, making it ideal for power management applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature rating ensures stable performance in challenging thermal conditions, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon material provides high reliability, temperature stability, and performance consistency, ensuring long-term operation and durability.

Maximum Drain Current (ID): 11 A

High maximum drain current rating allows for efficient power handling and reliable performance in various load conditions and applications.

Maximum Drain-Source On Resistance: 0.38 ohm

Low drain-source on resistance ensures minimal power loss and high efficiency during conduction, enhancing overall system performance.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and ensures proper alignment during installation, reducing the risk of errors and improving reliability.

Case Connection: DRAIN

Drain case connection simplifies circuit layout and improves thermal management, enhancing overall system reliability and performance.

Technical Specifications

Power Field Effect Transistors (FET) FCB11N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

340 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

33 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB11N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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