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FCA22N60N

Onsemi

FCA22N60N by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 205 W; Minimum DS Breakdown Voltage: 600 V; Maximum Drain-Source On Resistance: .165 ohm;

Median Price

$3.885

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 337 parts In-Stock

1+ parts

$3.930

100+ parts

$2.790

1k+ parts

$2.530

10k+ parts

-

337

$3.930

$2.790

$2.530

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Rochester

USA . 882 parts In-Stock

1+ parts

-

100+ parts

$3.840

1k+ parts

$3.430

10k+ parts

$3.230

882

-

$3.840

$3.430

$3.230

DigiKey

USA . 798 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.850

10k+ parts

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798

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$2.850

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Flip Electronics (Authorized)

USA . 798 parts In-Stock

1+ parts

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798

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Verical

USA . 528 parts In-Stock

1+ parts

-

100+ parts

$4.800

1k+ parts

$4.287

10k+ parts

$4.037

528

-

$4.800

$4.287

$4.037

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,453 parts In-Stock

1+ parts

$3.730

100+ parts

-

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-

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1,453

$3.730

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Digiode

USA . 497 parts In-Stock

1+ parts

$3.734

100+ parts

-

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497

$3.734

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Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$4.264

100+ parts

-

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45

$4.264

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Chip Stock

USA . 64,000 parts In-Stock

1+ parts

-

100+ parts

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64,000

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DigiKey Marketplace

USA . 882 parts In-Stock

1+ parts

-

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882

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Flip Electronics

USA . 798 parts In-Stock

1+ parts

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100+ parts

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798

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Distributors (Availability)

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$2.188

100+ parts

$1.991

1k+ parts

$1.794

10k+ parts

-

100

$2.188

$1.991

$1.794

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Corphita

USA . 698 parts In-Stock

1+ parts

$3.537

100+ parts

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698

$3.537

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Corohmni

South Africa . 105 parts In-Stock

1+ parts

$3.730

100+ parts

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105

$3.730

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Continental Prestige Electronics

USA . 978 parts In-Stock

1+ parts

$3.930

100+ parts

$2.790

1k+ parts

-

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978

$3.930

$2.790

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Microchip USA

USA . 333 parts In-Stock

1+ parts

$20.496

100+ parts

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333

$20.496

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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RC Electronics

USA . 7,222 parts In-Stock

1+ parts

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$4.350

1k+ parts

$3.970

10k+ parts

$3.850

7,222

-

$4.350

$3.970

$3.850

Problanco Electronics

Mexico . 2,720 parts In-Stock

1+ parts

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2,720

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Kulean Microsystems

USA . 2,148 parts In-Stock

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2,148

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TANS Electronics

Latvia . 1,896 parts In-Stock

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1,896

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Supply Digital

USA . 1,743 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,614 parts In-Stock

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SupplyDigital Components

Austria . 1,597 parts In-Stock

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S.R.D Solutions

India . 1,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,076 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 938 parts In-Stock

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938

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Perfect Parts

USA . 805 parts In-Stock

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805

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Kepictronics

USA . 800 parts In-Stock

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800

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Northwest PG Solutions

USA . 796 parts In-Stock

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796

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Native Components

USA . 646 parts In-Stock

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646

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Technical Specifications

Power Field Effect Transistors (FET) FCA22N60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

672 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

66 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCA22N60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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