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FCA20N60

Onsemi

FCA20N60 by Onsemi

FCA20N60 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 20A ID. Ideal for SWITCHING applications, it features a built-in DIODE, 0.19 ohm RDS(on), and can handle up to 60A IDM. Operating in ENHANCEMENT MODE, this transistor has an EAS of 690mJ and operates at temperatures up to 150°C.

Median Price

$5.990

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 372 parts In-Stock

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$5.990

100+ parts

$3.120

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372

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$3.120

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DigiKey

USA . 441 parts In-Stock

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$7.010

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$4.036

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$3.382

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441

$7.010

$4.036

$3.382

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Rochester

USA . 1,122 parts In-Stock

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$3.000

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$2.690

10k+ parts

$2.530

1,122

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$3.000

$2.690

$2.530

Flip Electronics (Authorized)

USA . 900 parts In-Stock

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900

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Digiode

USA . 1,504 parts In-Stock

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$3.164

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Vyrian

USA . 2,146 parts In-Stock

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$3.330

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$3.330

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Chip Stock

USA . 15,200 parts In-Stock

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15,200

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Carlin Systems, Inc.

USA . 718 parts In-Stock

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Flip Electronics

USA . 400 parts In-Stock

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Zilex Electronics Inc.

Canada . 166 parts In-Stock

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 737 parts In-Stock

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$1.511

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737

$1.511

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Northwest PG Solutions

USA . 4 parts In-Stock

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$1.662

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$1.662

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Component Stockers USA

USA . 406 parts In-Stock

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$2.900

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$2.370

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406

$2.900

$2.370

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Corphita

USA . 2,444 parts In-Stock

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$2.997

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Corohmni

South Africa . 305 parts In-Stock

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$3.330

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Microchip USA

USA . 7,254 parts In-Stock

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$12.610

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Perfect Parts

USA . 97,462 parts In-Stock

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Authorized Procurement Solutions

USA . 13,370 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,299 parts In-Stock

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Kulean Microsystems

USA . 5,695 parts In-Stock

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Problanco Electronics

Mexico . 5,393 parts In-Stock

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Kepictronics

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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TANS Electronics

Latvia . 3,099 parts In-Stock

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SupplyDigital Components

Austria . 1,680 parts In-Stock

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S.R.D Solutions

India . 1,500 parts In-Stock

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UHIMA Technologies

Türkiye . 976 parts In-Stock

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Supply Digital

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Eastek

USA . 30 parts In-Stock

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Overview

Elevate your power management systems with the FCA20N60 by Onsemi, a top-quality N-CHANNEL Power Field Effect Transistor. Manufactured to perfection by Onsemi, this transistor offers unparalleled reliability and efficiency in switching applications. Its single configuration with built-in diode ensures seamless operation, while its high breakdown voltage of 600V guarantees optimal performance. Whether you're looking to enhance your industrial equipment or upgrade your electronic devices, the FCA20N60 provides the value, benefits, and advantages that customers like you need to succeed. Step up your power game with Onsemi's trusted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and thermal resistance, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher current carrying capabilities compared to P-channel FETs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing efficiency and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and rapid performance in power control circuits.

Maximum Drain-Source On Resistance: 0.19 ohm

Low RDS(on) value indicates minimal power dissipation and high efficiency in the conduction state, making it suitable for high current applications.

Technical Specifications

Power Field Effect Transistors (FET) FCA20N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

690 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCA20N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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