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FCA20N60S-F109

Onsemi

FCA20N60S-F109 by Onsemi

FCA20N60S-F109 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 20A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 450mJ Avalanche Energy Rating, and operates in ENHANCEMENT MODE.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,535 parts In-Stock

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Digiode

USA . 2,319 parts In-Stock

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Native Components

USA . 730 parts In-Stock

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$10.070

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730

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Northwest PG Solutions

USA . 1,219 parts In-Stock

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$11.077

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$9.969

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TANS Electronics

Latvia . 5,863 parts In-Stock

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Problanco Electronics

Mexico . 5,439 parts In-Stock

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SupplyDigital Components

Austria . 4,075 parts In-Stock

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Corphita

USA . 2,008 parts In-Stock

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Kulean Microsystems

USA . 713 parts In-Stock

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Supply Digital

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Corohmni

South Africa . 432 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 217 parts In-Stock

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Overview

Enhance your power switching applications with the FCA20N60S-F109 by Onsemi. As a leading manufacturer in Power Field Effect Transistors (FET), Onsemi delivers top-quality products that guarantee reliable performance and durability. Ideal for various switching tasks, this N-CHANNEL transistor with a built-in diode offers exceptional value to customers seeking efficiency and precision in their designs. Trust Onsemi to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the power FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient operation and control of current flow in the specified direction, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode within the power FET, reducing the need for additional components.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and high efficiency, making it suitable for various electronic systems.

Minimum DS Breakdown Voltage: 600 V

Provides a high level of voltage protection, ensuring the power FET can handle demanding voltage requirements.

Maximum Drain Current (Abs) (ID): 20 A

Capable of handling high current loads, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 260 W

Efficiently dissipates heat generated during operation, preventing overheating and ensuring reliable performance.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance, providing versatility for various applications.

Technical Specifications

Power Field Effect Transistors (FET) FCA20N60S-F109 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

450 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

85 pF

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

550 ns

Maximum Turn On Time (ton):

370 ns

Trade Compliance

FCA20N60S-F109 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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