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ESD7371XV2T1G

Onsemi

ESD7371XV2T1G by Onsemi

ESD7371XV2T1G by Onsemi is a single avalanche diode with 7V breakdown voltage, ideal for transient suppression. With a max clamping voltage of 14V and operating temperature range from -55 to 150°C, it meets IEC-61000-4-2, 4-5 standards. This surface-mount device in small outline package is suitable for applications requiring unidirectional protection against voltage spikes.

Median Price

$0.128

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 661 parts In-Stock

1+ parts

$0.209

100+ parts

$0.188

1k+ parts

$0.178

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661

$0.209

$0.188

$0.178

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DigiKey

USA . 2,780 parts In-Stock

1+ parts

$0.450

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$0.191

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$0.097

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2,780

$0.450

$0.191

$0.097

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Mouser Electronics

USA . 21,424 parts In-Stock

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$0.060

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$0.060

Flip Electronics (Authorized)

USA . 5,905 parts In-Stock

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Farnell

UK . 1,219 parts In-Stock

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$0.130

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$0.077

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1,219

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$0.130

$0.077

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Element14

Singapore . 1,219 parts In-Stock

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$0.126

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$0.079

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$0.064

1,219

-

$0.126

$0.079

$0.064

Verical

USA . 661 parts In-Stock

1+ parts

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$0.178

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661

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$0.178

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Rochester

USA . 350 parts In-Stock

1+ parts

-

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$0.067

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$0.055

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$0.049

350

-

$0.067

$0.055

$0.049

Chip1Stop

Japan . 115 parts In-Stock

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$0.037

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115

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$0.037

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Distributors (In-Stock)

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Vyrian

USA . 434 parts In-Stock

1+ parts

$0.037

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434

$0.037

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Nova Conductors

Japan . 50 parts In-Stock

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$0.125

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50

$0.125

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Digiode

USA . 819 parts In-Stock

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$0.199

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819

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Flip Electronics

USA . 380,905 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 14,628 parts In-Stock

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Chip Stock

USA . 9,867 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,741 parts In-Stock

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Avant Electronics Limited

UK . 1,255 parts In-Stock

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Prism Electronics

USA . 41 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,966 parts In-Stock

1+ parts

$0.031

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9,966

$0.031

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Corohmni

South Africa . 74 parts In-Stock

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$0.037

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74

$0.037

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Corphita

USA . 537 parts In-Stock

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$0.188

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537

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Perfect Parts

USA . 408,361 parts In-Stock

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Authorized Procurement Solutions

USA . 48,258 parts In-Stock

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GreenTree Electronics

Israel . 48,000 parts In-Stock

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iodParts Technologies Inc.

India . 26,735 parts In-Stock

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TANS Electronics

Latvia . 5,703 parts In-Stock

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Kulean Microsystems

USA . 5,671 parts In-Stock

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Lixinc

USA . 5,540 parts In-Stock

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Argo Parts USA

USA . 2,942 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Continental Prestige Electronics

USA . 2,410 parts In-Stock

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SupplyDigital Components

Austria . 2,219 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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UHIMA Technologies

Türkiye . 951 parts In-Stock

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Problanco Electronics

Mexico . 805 parts In-Stock

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805

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Enhance your electronic devices with the ESD7371XV2T1G by Onsemi, a top-quality transient suppression device that ensures protection against voltage spikes and surges. Manufactured by Onsemi, a renowned leader in the industry, this product offers reliable performance and durability. Ideal for a wide range of applications, this single-configured device is designed for surface-mount installation, making it perfect for compact electronic designs. With a nominal breakdown voltage of 7V and maximum clamping voltage of 14V, the ESD7371XV2T1G provides peace of mind for your electronics by preventing damage from unforeseen voltage fluctuations. Boost the longevity and functionality of your devices with this high-performing product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the device.

Nominal Breakdown Voltage: 7 V

Effectively suppresses voltage spikes and protects connected devices from potential damage.

Maximum Operating Temperature: 150 °C

Allows the device to function in high temperature environments without compromising performance.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during reflow soldering processes, ensuring secure attachment to circuit boards.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Specifically designed to suppress voltage transients and protect sensitive electronic components.

Technical Specifications

Transient Suppression Devices ESD7371XV2T1G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Minimum Breakdown Voltage:

7 V

Nominal Breakdown Voltage:

7 V

Maximum Clamping Voltage:

14 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.3 W

Reference Standard:

IEC-61000-4-2, 4-5

Maximum Repetitive Peak Reverse Voltage:

5.3 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD7371XV2T1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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