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ESD7410N2T5G

Onsemi

ESD7410N2T5G by Onsemi

ESD7410N2T5G by Onsemi is a unidirectional avalanche diode with 8V reverse test voltage, ideal for transient suppression applications. With a max clamping voltage of 19.4V and operating temperature range from -55°C to 150°C, it offers reliable protection against ESD events in electronic circuits. This chip carrier package features bottom terminal position and nickel/palladium/gold finish for surface mount assembly.

Median Price

$0.204

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 64,915 parts In-Stock

1+ parts

$0.540

100+ parts

$0.213

1k+ parts

$0.143

10k+ parts

$0.106

64,915

$0.540

$0.213

$0.143

$0.106

Arrow

USA . 80,000 parts In-Stock

1+ parts

$17.370

100+ parts

-

1k+ parts

-

10k+ parts

-

80,000

$17.370

-

-

-

Rochester

USA . 222,758 parts In-Stock

1+ parts

-

100+ parts

$0.121

1k+ parts

$0.101

10k+ parts

$0.090

222,758

-

$0.121

$0.101

$0.090

Mouser Electronics

USA . 128,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.089

128,153

-

-

-

$0.089

Verical

USA . 112,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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$0.112

112,000

-

-

-

$0.112

Farnell

UK . 110,758 parts In-Stock

1+ parts

-

100+ parts

$0.288

1k+ parts

$0.139

10k+ parts

-

110,758

-

$0.288

$0.139

-

Flip Electronics (Authorized)

USA . 80,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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80,000

-

-

-

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Chip1Stop

Japan . 17 parts In-Stock

1+ parts

-

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-

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17

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 224 parts In-Stock

1+ parts

$0.094

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$0.094

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.122

100+ parts

-

1k+ parts

-

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100

$0.122

-

-

-

Vyrian

USA . 85,469 parts In-Stock

1+ parts

-

100+ parts

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85,469

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Flip Electronics

USA . 80,000 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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80,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 85,525 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

-

10k+ parts

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85,525

$0.076

-

-

-

Corohmni

South Africa . 200 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

-

10k+ parts

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200

$0.089

-

-

-

Corphita

USA . 1,964 parts In-Stock

1+ parts

$0.089

100+ parts

-

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10k+ parts

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1,964

$0.089

-

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-

Argo Parts USA

USA . 3,295 parts In-Stock

1+ parts

$0.122

100+ parts

-

1k+ parts

-

10k+ parts

$0.118

3,295

$0.122

-

-

$0.118

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.122

100+ parts

-

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2,000

$0.122

-

-

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Continental Prestige Electronics

USA . 124,758 parts In-Stock

1+ parts

-

100+ parts

$0.108

1k+ parts

-

10k+ parts

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124,758

-

$0.108

-

-

Problanco Electronics

Mexico . 7,972 parts In-Stock

1+ parts

-

100+ parts

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7,972

-

-

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SupplyDigital Components

Austria . 3,034 parts In-Stock

1+ parts

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3,034

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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1,500

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-

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GreenTree Electronics

Israel . 1,200 parts In-Stock

1+ parts

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100+ parts

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1,200

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TANS Electronics

Latvia . 1,121 parts In-Stock

1+ parts

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1,121

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Kulean Microsystems

USA . 561 parts In-Stock

1+ parts

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561

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UHIMA Technologies

Türkiye . 295 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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295

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Overview

Enhance your electronics with the ESD7410N2T5G by Onsemi, a top-tier manufacturer known for delivering quality transient suppression devices. These devices provide reliable protection against voltage spikes, ensuring the longevity and performance of your sensitive components. With a wide operating temperature range and high clamping voltage, this product offers peace of mind for your applications. Trust Onsemi to safeguard your electronics with cutting-edge technology and superior design. Elevate your projects with the ESD7410N2T5G and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the device.

Maximum Reverse Current: 1 uA

Low reverse current ensures minimal power loss and efficient operation of the device.

Minimum Breakdown Voltage: 10 V

High minimum breakdown voltage provides reliable protection against voltage spikes and surges.

Technology: AVALANCHE

Avalanche technology allows for high energy handling capabilities and fast response times to transient events.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with international standards ensures the product's quality and performance in different applications.

Technical Specifications

Transient Suppression Devices ESD7410N2T5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Minimum Breakdown Voltage:

10 V

Maximum Clamping Voltage:

19.4 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

.3 W

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

8 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

8 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ESD7410N2T5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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