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ESD7361XV2T5G

Onsemi

ESD7361XV2T5G by Onsemi

ESD7361XV2T5G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 16V max repetitive peak reverse voltage and 34V max clamping voltage. It operates b/w -55 to 125 °C, complies with IEC-61000-4-2, 4-4, 4-5 standards, and is ideal for transient suppression in electronic circuits.

Median Price

$0.091

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 76,000 parts In-Stock

1+ parts

-

100+ parts

$0.095

1k+ parts

$0.078

10k+ parts

$0.070

76,000

-

$0.095

$0.078

$0.070

Verical

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.087

60,000

-

-

-

$0.087

Distributors (In-Stock)

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Digiode

USA . 2,054 parts In-Stock

1+ parts

$0.110

100+ parts

-

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2,054

$0.110

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Chip Stock

USA . 61,000 parts In-Stock

1+ parts

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61,000

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-

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Vyrian

USA . 9,807 parts In-Stock

1+ parts

-

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9,807

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,289 parts In-Stock

1+ parts

$0.104

100+ parts

-

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2,289

$0.104

-

-

-

Corohmni

South Africa . 123 parts In-Stock

1+ parts

$0.116

100+ parts

-

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123

$0.116

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Native Components

USA . 175 parts In-Stock

1+ parts

$0.849

100+ parts

-

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175

$0.849

-

-

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Northwest PG Solutions

USA . 159 parts In-Stock

1+ parts

$0.933

100+ parts

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159

$0.933

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AZTECH Wire

Italy . 1,119 parts In-Stock

1+ parts

$19.090

100+ parts

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1,119

$19.090

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SupplyDigital Components

Austria . 6,324 parts In-Stock

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6,324

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TANS Electronics

Latvia . 6,146 parts In-Stock

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6,146

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Problanco Electronics

Mexico . 5,576 parts In-Stock

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5,576

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Kulean Microsystems

USA . 976 parts In-Stock

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976

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UHIMA Technologies

Türkiye . 941 parts In-Stock

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941

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Overview

Enhance your electronics with the ESD7361XV2T5G by Onsemi, a top-tier manufacturer known for superior quality and reliability. As a leading product in the Transient Suppression Devices category, this single-configured device offers unmatched protection against voltage spikes and surges, ensuring the longevity of your equipment. With a maximum clamping voltage of 34V and a reverse test voltage of 15V, this small-outline package is perfect for a wide range of applications. Trust Onsemi to deliver peak performance and peace of mind with the ESD7361XV2T5G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides excellent durability and resistance to environmental factors, making the product reliable for long-term use.

Config: SINGLE

The single configuration simplifies installation and reduces complexity in circuit design, making it easier to integrate into various systems.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Reverse Current: 1 uA

The low maximum reverse current ensures minimal power loss and efficient operation, leading to better energy efficiency.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, making it suitable for applications with limited space constraints.

Reverse Test Voltage: 15 V

The 15V reverse test voltage rating ensures effective protection against reverse voltage spikes and surges, safeguarding the connected components.

No. of Terminals: 2

The two terminals simplify the connection process and reduce the chances of errors during installation or replacement.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for easy handling and integration into various electronic devices or systems without taking up much space.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable performance in a wide range of environmental conditions, making it suitable for diverse applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature rating enables the product to function effectively in cold environments, increasing its versatility.

Technical Specifications

Transient Suppression Devices ESD7361XV2T5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

LOW CAPACITANCE, ULTRA LOW CAPACITANCE

Minimum Breakdown Voltage:

16.5 V

Maximum Clamping Voltage:

34 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5; ISO 10605

Maximum Repetitive Peak Reverse Voltage:

16 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

15 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD7361XV2T5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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