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EFC6612R-TF

Onsemi

EFC6612R-TF by Onsemi

EFC6612R-TF by Onsemi is an N-CHANNEL Power FET with 23A max drain current and 2.5W power dissipation. Utilizes Metal-Oxide Semiconductor tech, operates up to 150°C. Ideal for high-power applications requiring surface mount compatibility.

Median Price

$1.013

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 9,959 parts In-Stock

1+ parts

$1.520

100+ parts

$0.640

1k+ parts

$0.458

10k+ parts

$0.359

9,959

$1.520

$0.640

$0.458

$0.359

Mouser Electronics

USA . 4,934 parts In-Stock

1+ parts

$1.520

100+ parts

$0.640

1k+ parts

$0.440

10k+ parts

$0.420

4,934

$1.520

$0.640

$0.440

$0.420

Rochester

USA . 1,552,190 parts In-Stock

1+ parts

-

100+ parts

$0.488

1k+ parts

$0.405

10k+ parts

$0.361

1,552,190

-

$0.488

$0.405

$0.361

Verical

USA . 1,552,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.506

10k+ parts

$0.452

1,552,190

-

-

$0.506

$0.452

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,315 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

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1,315

$0.360

-

-

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Digiode

USA . 2,195 parts In-Stock

1+ parts

$0.379

100+ parts

-

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10k+ parts

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2,195

$0.379

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Chip Stock

USA . 50,993 parts In-Stock

1+ parts

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50,993

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Prism Electronics

USA . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 878 parts In-Stock

1+ parts

$0.359

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$0.359

-

-

-

Corohmni

South Africa . 441 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

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441

$0.360

-

-

-

Microchip USA

USA . 286 parts In-Stock

1+ parts

$2.540

100+ parts

$2.530

1k+ parts

$2.530

10k+ parts

$2.520

286

$2.540

$2.530

$2.530

$2.520

Native Components

USA . 711 parts In-Stock

1+ parts

$57.700

100+ parts

-

1k+ parts

-

10k+ parts

$55.392

711

$57.700

-

-

$55.392

Northwest PG Solutions

USA . 1,417 parts In-Stock

1+ parts

$63.470

100+ parts

-

1k+ parts

-

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1,417

$63.470

-

-

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Continental Prestige Electronics

USA . 1,928,995 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.388

10k+ parts

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1,928,995

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$0.388

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RC Electronics

USA . 84,805 parts In-Stock

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84,805

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Kepictronics

USA . 71,277 parts In-Stock

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71,277

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Authorized Procurement Solutions

USA . 50,000 parts In-Stock

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50,000

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Perfect Parts

USA . 11,200 parts In-Stock

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11,200

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Problanco Electronics

Mexico . 5,855 parts In-Stock

1+ parts

-

100+ parts

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5,855

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-

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Kulean Microsystems

USA . 1,377 parts In-Stock

1+ parts

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1,377

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SupplyDigital Components

Austria . 1,368 parts In-Stock

1+ parts

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1,368

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TANS Electronics

Latvia . 297 parts In-Stock

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297

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UHIMA Technologies

Türkiye . 74 parts In-Stock

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74

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Overview

Unleash the power of innovation with the EFC6612R-TF by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unmatched quality and reliability in their Power Field Effect Transistors (FET). Ideal for applications requiring high performance and efficiency, this N-CHANNEL FET offers a maximum drain current of 23 A and a maximum power dissipation of 2.5 W. With its cutting-edge METAL-OXIDE SEMICONDUCTOR technology, this transistor can handle even the most demanding tasks with ease. Elevate your projects to new heights with the EFC6612R-TF and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications due to their lower conduction losses and faster switching speeds compared to P-CHANNEL FETs.

Surface Mount: YES

Surface mount FETs are easier to solder onto circuit boards, making them more suitable for automated manufacturing processes and compact designs.

Maximum Drain Current (Abs) (ID): 23 A

With a high maximum drain current, this FET can handle large amounts of current without overheating or failing, making it suitable for high power applications.

Maximum Power Dissipation (Abs): 2.5 W

The low maximum power dissipation ensures that the FET does not get too hot during operation, increasing its reliability and lifespan.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology provides good performance and reliability in high power applications, making this FET a reliable choice for demanding circuits.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand high temperatures without losing performance, making it suitable for harsh environments or high power applications.

Maximum Drain Current (ID): 23 A

The high maximum drain current rating allows this FET to handle large current loads without overheating, making it a reliable choice for high power applications.

Technical Specifications

Power Field Effect Transistors (FET) EFC6612R-TF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

EFC6612R-TF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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