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EFC6611R-TF

Onsemi

EFC6611R-TF by Onsemi

EFC6611R-TF by Onsemi is an N-CHANNEL Power FET with 27A Max Drain Current and 2.5W Max Power Dissipation. Utilizes Metal-Oxide Semiconductor tech, operates up to 150 °C. Ideal for power management applications requiring high current handling in compact designs.

Median Price

$1.082

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,167 parts In-Stock

1+ parts

$1.740

100+ parts

$0.707

1k+ parts

$0.475

10k+ parts

$0.369

4,167

$1.740

$0.707

$0.475

$0.369

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$0.423

1k+ parts

$0.351

10k+ parts

$0.313

1

-

$0.423

$0.351

$0.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,097 parts In-Stock

1+ parts

$0.262

100+ parts

-

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-

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1,097

$0.262

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-

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Digiode

USA . 2,191 parts In-Stock

1+ parts

$0.330

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-

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2,191

$0.330

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Chip Stock

USA . 46,000 parts In-Stock

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46,000

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Distributors (Availability)

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Corohmni

South Africa . 209 parts In-Stock

1+ parts

$0.262

100+ parts

-

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209

$0.262

-

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Corphita

USA . 240 parts In-Stock

1+ parts

$0.312

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240

$0.312

-

-

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Native Components

USA . 9 parts In-Stock

1+ parts

$0.333

100+ parts

-

1k+ parts

-

10k+ parts

$0.320

9

$0.333

-

-

$0.320

Component Stockers USA

USA . 1 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

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-

1

$0.350

-

-

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Northwest PG Solutions

USA . 1,350 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

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10k+ parts

$0.323

1,350

$0.366

-

-

$0.323

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$0.470

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1

$0.470

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Kepictronics

USA . 58,724 parts In-Stock

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58,724

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TANS Electronics

Latvia . 7,326 parts In-Stock

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7,326

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SupplyDigital Components

Austria . 6,948 parts In-Stock

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6,948

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A-Z Elektronik GmbH

Germany . 5,939 parts In-Stock

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Problanco Electronics

Mexico . 4,346 parts In-Stock

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4,346

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Alle Elektronik GmbH

Germany . 3,959 parts In-Stock

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3,959

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kulean Microsystems

USA . 1,226 parts In-Stock

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1,226

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UHIMA Technologies

Türkiye . 741 parts In-Stock

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741

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Overview

Discover the superior quality and reliability of the EFC6611R-TF by Onsemi, a leading manufacturer in the power field effect transistor (FET) category. Perfect for applications requiring N-CHANNEL polarity or channel type, this surface mount FET boasts a maximum drain current of 27A and a power dissipation of 2.5W. With advanced metal-oxide semiconductor technology and a maximum operating temperature of 150 °C, this product delivers exceptional performance and efficiency. Elevate your projects with the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power applications due to their superior performance and efficiency compared to P-channel FETs.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this FET suitable for modern electronic designs.

Maximum Drain Current (Abs) (ID): 27 A

High maximum drain current capability means this FET can handle larger loads and is suitable for high-power applications.

Maximum Power Dissipation (Abs): 2.5 W

The low maximum power dissipation helps in reducing heat generation and improving overall efficiency of the system.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers excellent performance, reliability, and fast switching speeds, making this FET ideal for various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising its performance, ensuring reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) EFC6611R-TF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

EFC6611R-TF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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