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EFC6604R-TR

Onsemi

EFC6604R-TR by Onsemi

EFC6604R-TR by Onsemi is a N-channel Power FET with common drain configuration, built-in diode and resistor. Ideal for switching applications, it operates in depletion mode with 2 elements and 6 terminals in a grid array package. Made of silicon using metal-oxide semiconductor technology, it's a surface-mount device suitable for various electronic designs.

Median Price

$0.165

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,116,020 parts In-Stock

1+ parts

-

100+ parts

$0.178

1k+ parts

$0.148

10k+ parts

$0.132

1,116,020

-

$0.178

$0.148

$0.132

Verical

USA . 1,061,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.165

1,061,930

-

-

-

$0.165

Mouser Electronics

USA . 4,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.136

4,621

-

-

-

$0.136

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,828 parts In-Stock

1+ parts

$0.136

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$0.136

-

-

-

Digiode

USA . 1,523 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

10k+ parts

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1,523

$0.139

-

-

-

Chip Stock

USA . 18,511 parts In-Stock

1+ parts

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100+ parts

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18,511

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 243 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$0.110

-

-

-

Corphita

USA . 2,114 parts In-Stock

1+ parts

$0.131

100+ parts

-

1k+ parts

-

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2,114

$0.131

-

-

-

Native Components

USA . 285 parts In-Stock

1+ parts

$0.152

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

285

$0.152

-

-

$0.146

Northwest PG Solutions

USA . 29 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

-

10k+ parts

$0.147

29

$0.167

-

-

$0.147

Continental Prestige Electronics

USA . 1,221,020 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.119

10k+ parts

-

1,221,020

-

-

$0.119

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Kepictronics

USA . 59,000 parts In-Stock

1+ parts

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100+ parts

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59,000

-

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Futuretech Components

Singapore . 50,000 parts In-Stock

1+ parts

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100+ parts

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50,000

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-

-

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SupplyDigital Components

Austria . 8,047 parts In-Stock

1+ parts

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100+ parts

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8,047

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A-Z Elektronik GmbH

Germany . 5,711 parts In-Stock

1+ parts

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5,711

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-

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Problanco Electronics

Mexico . 5,674 parts In-Stock

1+ parts

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100+ parts

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5,674

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,000

-

-

-

-

TANS Electronics

Latvia . 4,436 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,436

-

-

-

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Alle Elektronik GmbH

Germany . 3,807 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,807

-

-

-

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Kulean Microsystems

USA . 3,192 parts In-Stock

1+ parts

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100+ parts

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3,192

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-

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UHIMA Technologies

Türkiye . 388 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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388

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-

Overview

Unlock the power of efficient and reliable switching with the EFC6604R-TR by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance in their Power Field Effect Transistors (FET). Ideal for a variety of applications, this N-CHANNEL transistor boasts a common drain configuration with built-in diode and resistor, making it a versatile choice for your projects. Experience seamless operation and superior functionality with the EFC6604R-TR, providing customers with unmatched value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor provide added functionality and protection, simplifying circuit design and improving overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast switching speeds and efficient performance in various electronic circuits.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and enabling compact designs.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to handle and mount the transistor onto the PCB, ensuring proper alignment and connection.

Terminal Form: BALL

The ball terminal form provides good electrical contact and reliability, reducing the chances of signal loss or interference.

Operating Mode: DEPLETION MODE

Depletion mode FETs can be used in applications where the transistor is normally ON until a control voltage is applied, offering flexibility in circuit design.

No. of Elements: 2

Having 2 elements allows for more complex circuit configurations and applications, enhancing the versatility of the transistor.

No. of Terminals: 6

With 6 terminals, there are more connection options available, enabling greater design flexibility and functionality.

Package Style: GRID ARRAY

The grid array package style provides a compact and organized arrangement of terminals, simplifying the PCB layout and assembly process.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making the transistor suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon-based transistors are known for their high performance and reliability, ensuring consistent operation over a wide temperature range.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and connection to the PCB, improving overall circuit reliability and performance.

Technical Specifications

Power Field Effect Transistors (FET) EFC6604R-TR attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PBGA-B6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

BALL

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

EFC6604R-TR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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