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DTD113ERL1

Onsemi

DTD113ERL1 by Onsemi

Onsemi's DTD113ERL1 is a NPN BJT with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, max collector current of 0.1A, and min DC current gain of 3. The transistor is housed in a cylindrical package with through-hole terminals made of silicon material.

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< 1k

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Vyrian

USA . 477 parts In-Stock

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Digiode

USA . 300 parts In-Stock

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Native Components

USA . 26 parts In-Stock

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$10.842

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Northwest PG Solutions

USA . 55 parts In-Stock

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$11.926

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$10.734

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SupplyDigital Components

Austria . 7,185 parts In-Stock

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Problanco Electronics

Mexico . 7,065 parts In-Stock

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TANS Electronics

Latvia . 5,283 parts In-Stock

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Kulean Microsystems

USA . 5,244 parts In-Stock

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Corphita

USA . 963 parts In-Stock

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Enhance your electronic projects with the DTD113ERL1 by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology in small signal bipolar junction transistors. With a focus on switching applications, this NPN transistor offers seamless performance and efficiency. The built-in resistor simplifies circuit design, making it ideal for a wide range of projects. Trust Onsemi to provide exceptional value and unparalleled benefits with the DTD113ERL1. Elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

Common NPN transistor type for general purpose use.

Configuration: SINGLE WITH BUILT-IN RESISTOR

Saves space and simplifies circuit design by incorporating a resistor within the transistor package.

Transistor Application: SWITCHING

Optimized for switching applications, making it efficient and reliable.

Package Shape: ROUND

Round shape offers easy mounting and handling during installation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering.

No. of Terminals: 3

Simple and straightforward 3-terminal configuration for basic circuit connections.

Package Style (Meter): CYLINDRICAL

Cylindrical package style is compact and efficient for space-constrained applications.

Minimum DC Current Gain (hFE): 3

Low minimum DC current gain allows for flexibility in different circuit designs.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance for reliable performance in various environments.

Maximum Collector-Emitter Voltage: 50 V

Can handle up to 50 volts safely for diverse electronic applications.

Transistor Element Material: SILICON

Silicon material offers high performance and efficiency in transistor operation.

Maximum Collector Current (IC): 0.1 A

Capable of handling up to 0.1 ampere of collector current for moderate power requirements.

Terminal Finish: TIN LEAD

Tin lead finish ensures good conductivity and reliable connections.

Terminal Position: BOTTOM

Bottom terminal position for easy installation and integration into circuit boards.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) DTD113ERL1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1, EUROPEAN PART NUMBER

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

3

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DTD113ERL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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