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CAV25512HU5E-GT3

Onsemi

CAV25512HU5E-GT3 by Onsemi

CAV25512HU5E-GT3 by Onsemi is an AEC-Q100 EEPROM with 64KX8 organization, operating at 5V. It features a serial SPI interface, 10 MHz clock frequency, and -40 to 125°C temperature range. Ideal for automotive applications requiring reliable non-volatile memory storage in a compact form factor.

Median Price

$2.463

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 71 parts In-Stock

1+ parts

-

100+ parts

$0.696

1k+ parts

$0.577

10k+ parts

$0.515

71

-

$0.696

$0.577

$0.515

DigiKey

USA . 71 parts In-Stock

1+ parts

-

100+ parts

$4.230

1k+ parts

-

10k+ parts

-

71

-

$4.230

-

-

Distributors (In-Stock)

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Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

$0.460

100+ parts

-

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10k+ parts

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9,000

$0.460

-

-

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Digiode

USA . 956 parts In-Stock

1+ parts

$0.541

100+ parts

-

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956

$0.541

-

-

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Vyrian

USA . 6,125 parts In-Stock

1+ parts

-

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6,125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,915 parts In-Stock

1+ parts

$0.512

100+ parts

-

1k+ parts

-

10k+ parts

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1,915

$0.512

-

-

-

Corohmni

South Africa . 205 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

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205

$0.569

-

-

-

Component Stockers USA

USA . 60 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

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60

$0.750

-

-

-

Native Components

USA . 994 parts In-Stock

1+ parts

$8.760

100+ parts

-

1k+ parts

-

10k+ parts

-

994

$8.760

-

-

-

Northwest PG Solutions

USA . 693 parts In-Stock

1+ parts

$9.636

100+ parts

$8.672

1k+ parts

-

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693

$9.636

$8.672

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Microchip USA

USA . 4,565 parts In-Stock

1+ parts

$10.416

100+ parts

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4,565

$10.416

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AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$11.380

100+ parts

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462

$11.380

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Continental Prestige Electronics

USA . 18,071 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.749

10k+ parts

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18,071

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$0.749

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Kulean Microsystems

USA . 8,043 parts In-Stock

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8,043

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TANS Electronics

Latvia . 7,030 parts In-Stock

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7,030

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Problanco Electronics

Mexico . 5,282 parts In-Stock

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5,282

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SupplyDigital Components

Austria . 3,206 parts In-Stock

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3,206

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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UHIMA Technologies

Türkiye . 482 parts In-Stock

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482

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Overview

Unlock the potential of your automotive applications with the high-quality CAV25512HU5E-GT3 EEPROM from Onsemi. Designed to meet AEC-Q100 standards, this small outline memory device offers a reliable solution for storing critical data in harsh environments. With a wide operating temperature range and a serial SPI interface, this EEPROM provides flexibility and performance. Trust Onsemi's reputation for excellence and invest in a product that delivers value, benefits, and advantages to your projects. Choose the CAV25512HU5E-GT3 for seamless integration and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various applications.

Surface Mount: Yes

The surface mount feature allows for easy and convenient installation on circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making it ideal for automotive applications.

Operating Mode: SYNCHRONOUS

The synchronous operation mode allows for efficient data transfer and communication with other synchronous devices.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides stable power to the EEPROM for reliable performance.

Organization: 64KX8

The 64KX8 organization allows for storing and accessing large amounts of data efficiently.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this EEPROM suitable for use in extreme environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for energy-efficient performance.

Serial Bus Type: SPI

The SPI serial bus type enables fast and reliable data communication between the EEPROM and other devices.

Memory Density: 524288 bit

With a high memory density, this EEPROM can store a large amount of data in a compact form.

Technical Specifications

EEPROM CAV25512HU5E-GT3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

10 MHz

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAV25512HU5E-GT3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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