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CAT9554AHV4I-G

Onsemi

CAT9554AHV4I-G by Onsemi

CAT9554AHV4I-G by Onsemi is an 8-bit Parallel I/O Port with 2.5/5 V power supplies, CMOS technology, and -40 to 85 °C operating temperature range. Ideal for industrial applications requiring a compact (4x4 mm) surface-mount chip carrier package with 16 terminals and 8 I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,519 parts In-Stock

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Vyrian

USA . 213 parts In-Stock

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Problanco Electronics

Mexico . 6,726 parts In-Stock

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Kulean Microsystems

USA . 5,654 parts In-Stock

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SupplyDigital Components

Austria . 3,222 parts In-Stock

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TANS Electronics

Latvia . 3,135 parts In-Stock

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Corphita

USA . 2,311 parts In-Stock

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Northwest PG Solutions

USA . 1,453 parts In-Stock

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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Corohmni

South Africa . 317 parts In-Stock

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Native Components

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Overview

Enhance your electronic designs with the CAT9554AHV4I-G from Onsemi, a top-tier manufacturer known for its high-quality products. This Parallel I/O Ports device offers unparalleled performance and versatility, making it ideal for a wide range of applications. With a maximum supply voltage of 5.5V, dual power supplies, and a temperature grade of industrial, this chip carrier with heat sink/slug is perfect for general purpose parallel IO port tasks. Trust in Onsemi to deliver innovative solutions that meet your needs and exceed your expectations. Upgrade your projects with the CAT9554AHV4I-G and experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation on a printed circuit board, saving valuable space and enabling a sleek design.

Maximum Supply Voltage: 5.5 V

Ability to handle a high supply voltage range makes this product versatile and suitable for a variety of applications.

Package Shape: SQUARE

The square package shape helps in efficient placement on the PCB and simplifies the design layout.

No. of Bits: 8

Provides a wide range of communication options and flexibility in data transfer.

Power Supplies (V): 2.5/5

Supports multiple power supply options, enabling compatibility with different systems and setups.

No. of Terminals: 16

Having a higher number of terminals allows for more connections and functionalities to be supported.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offers flexibility in mounting options and thermal management strategies.

Minimum Supply Voltage: 2.3 V

Can operate effectively even at low supply voltages, ensuring consistent performance in different scenarios.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Able to function in extremely low temperatures, enhancing its reliability in various conditions.

Terminal Position: QUAD

The quad terminal position provides a balanced layout for efficient signal routing and connectivity.

Maximum Seated Height: 0.8 mm

Low seated height allows for compact designs and minimal space requirements in the overall system.

Width: 4 mm

Slim width facilitates easy integration into different PCB layouts and compact electronic devices.

Length: 4 mm

Compact length contributes to the overall space-saving aspect of the product and enhances its versatility.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environments and applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port allows for diverse applications and versatile usage in various electronic systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and enhances the product's sustainability.

Nominal Supply Voltage: 3 V

Standard 3V supply voltage ensures compatibility with many existing systems and components.

Terminal Pitch: 0.65 mm

The small terminal pitch enables precise connections and compact design layouts on the PCB.

No. of I/O Lines: 8

Having 8 I/O lines provides sufficient flexibility and connectivity options for various input/output requirements.

Technical Specifications

Parallel I/O Ports CAT9554AHV4I-G attributes and parameters. Explore more Parallel I/O Ports devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N16

Length:

4 mm

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CAT9554AHV4I-G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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