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CAT9534HV4I-G

Onsemi

CAT9534HV4I-G by Onsemi

CAT9534HV4I-G by Onsemi is an 8-bit parallel I/O port with a supply voltage range of 2.3V to 5.5V, ideal for industrial applications. This CMOS technology chip carrier has a compact square shape, quad terminals, and operates b/w -40 °C to 85°C. With nickel palladium gold finish and no-lead terminal form, it offers versatile general-purpose functionality in a very thin profile package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 468 parts In-Stock

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468

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Vyrian

USA . 204 parts In-Stock

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204

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Distributors (Availability)

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Native Components

USA . 536 parts In-Stock

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$5.594

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TANS Electronics

Latvia . 8,372 parts In-Stock

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Problanco Electronics

Mexico . 4,586 parts In-Stock

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SupplyDigital Components

Austria . 3,216 parts In-Stock

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Corphita

USA . 1,992 parts In-Stock

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UHIMA Technologies

Türkiye . 798 parts In-Stock

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Kulean Microsystems

USA . 467 parts In-Stock

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Corohmni

South Africa . 54 parts In-Stock

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Northwest PG Solutions

USA . 40 parts In-Stock

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$5.482

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$5.482

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Overview

Experience seamless connectivity and enhanced functionality with the CAT9534HV4I-G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. The CAT9534HV4I-G falls under the category of Parallel I/O Ports, offering unparalleled performance and versatility. Ideal for a wide range of applications, this product is a game-changer in the realm of electronics. Discover the value and benefits this innovative device brings to your projects, providing you with unmatched reliability and efficiency. Elevate your designs with the CAT9534HV4I-G from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, making this product suitable for small electronic devices with limited space.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in the power supply options for the device, allowing for reliable operation even with higher supply voltages.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on the PCB, making it ideal for applications where board space is limited.

No. of Bits: 8

The 8-bit parallel I/O port allows for efficient data transfer between the device and external components, providing a wide range of interfacing possibilities.

Power Supplies (V): 2.5/5

Support for multiple power supply voltages (2.5V and 5V) offers compatibility with various power sources, making it versatile for different system requirements.

No. of Terminals: 16

The 16 terminals provide enough connectivity options for interfacing with other components, ensuring versatility and expandability in the device design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer flexibility in design options, allowing for efficient heat dissipation and compact form factor, making it suitable for various applications.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage of 2.3V ensures compatibility with a wide range of power sources, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 °C to 85°C ensures reliable performance in harsh environmental conditions, making it suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for long-term performance.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and PCB assembly, providing a secure and stable connection for reliable operation.

Maximum Seated Height: 0.8 mm

The low seated height of 0.8mm enables a slim profile design and helps reduce the overall size of the device, making it suitable for compact electronic products.

Width: 4 mm

The 4mm width provides a compact form factor, making it suitable for applications where board space is limited and requiring small footprint components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures secure solder joints during assembly, making it suitable for automated soldering processes.

Length: 4 mm

The 4mm length offers a balanced form factor, making it suitable for space-constrained applications while providing adequate terminal spacing for ease of assembly.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures reliable operation in harsh environments with wide temperature variations, making it suitable for industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this product offers flexibility and versatility in interfacing with various external devices, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for use in battery-operated devices and noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the PCB assembly process and ensures reliable solder joints, making it suitable for high-volume manufacturing and automated assembly.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V provides a common voltage level for most digital systems, ensuring compatibility and ease of integration with other components in the system.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for high-density packaging and smaller PCB designs, making it suitable for compact electronic devices with limited space.

No. of I/O Lines: 8

With 8 I/O lines, this parallel I/O port provides sufficient input and output channels for interfacing with external peripherals, allowing for versatile connectivity options in the device design.

Technical Specifications

Parallel I/O Ports CAT9534HV4I-G attributes and parameters. Explore more Parallel I/O Ports devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

4 mm

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CAT9534HV4I-G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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