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CAT9554AHV4I

Onsemi

CAT9554AHV4I by Onsemi

CAT9554AHV4I by Onsemi is a CMOS technology IC with 8 I/O lines, operating at -40 to 85 °C. It has a supply voltage range of 2.3-5.5 V and comes in a square chip carrier package. Ideal for industrial applications requiring parallel I/O ports with very thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 810 parts In-Stock

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Vyrian

USA . 511 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 636 parts In-Stock

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$48.915

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$46.958

636

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$46.958

Northwest PG Solutions

USA . 1,041 parts In-Stock

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$53.806

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Kulean Microsystems

USA . 8,226 parts In-Stock

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TANS Electronics

Latvia . 7,538 parts In-Stock

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SupplyDigital Components

Austria . 2,765 parts In-Stock

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Problanco Electronics

Mexico . 2,636 parts In-Stock

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UHIMA Technologies

Türkiye . 641 parts In-Stock

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Corohmni

South Africa . 454 parts In-Stock

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Corphita

USA . 123 parts In-Stock

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Overview

Discover the CAT9554AHV4I by Onsemi, a high-quality Parallel I/O Ports peripheral IC that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted industry leader, this versatile chip carrier is perfect for a wide range of industrial applications. With a very thin profile and 16 terminals, this product boasts a supply voltage range of 2.3V to 5.5V, making it ideal for demanding environments. Experience seamless connectivity with 8 I/O lines and maximize efficiency with its CMOS technology. Elevate your projects with the CAT9554AHV4I and unlock endless possibilities in industrial automation and control systems.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for automated manufacturing processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in powering the device, making it compatible with various systems and applications.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it ideal for compact electronic designs.

No. of Terminals: 16

With 16 terminals, this product provides ample connectivity options, enabling versatile input and output configurations for different use cases.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage ensures compatibility with power-sensitive devices and allows for operation in energy-efficient systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this product suitable for industrial environments where elevated temperatures may be present.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in sub-zero conditions, making it suitable for a wide range of operating environments.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and conductivity, ensuring reliable connections and long-term performance of the product.

Width: 4 mm

The compact width of 4 mm allows for space-efficient placement on the PCB, enabling streamlined circuit layout and optimization of board real estate.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in minimizing interference.

Technical Specifications

Parallel I/O Ports CAT9554AHV4I attributes and parameters. Explore more Parallel I/O Ports devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CAT9554AHV4I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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