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CAT8710FTD-GT3

Onsemi

CAT8710FTD-GT3 by Onsemi

CAT8710FTD-GT3 by Onsemi is a Power Management IC with Vsup range of 1.5V to 5.5V, suitable for industrial applications. It features a small outline package with dual terminals and adjustable threshold, operating b/w -40 °C to 85°C. Ideal for power supply management circuits requiring compact design and precise voltage control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,666 parts In-Stock

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Digiode

USA . 1,133 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 823 parts In-Stock

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$0.615

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823

$0.615

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Northwest PG Solutions

USA . 879 parts In-Stock

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$0.677

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879

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AZTECH Wire

Italy . 388 parts In-Stock

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$20.460

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388

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Kepictronics

USA . 20,000 parts In-Stock

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TANS Electronics

Latvia . 7,446 parts In-Stock

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Kulean Microsystems

USA . 7,068 parts In-Stock

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SupplyDigital Components

Austria . 7,030 parts In-Stock

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Problanco Electronics

Mexico . 4,660 parts In-Stock

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Corphita

USA . 977 parts In-Stock

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UHIMA Technologies

Türkiye . 707 parts In-Stock

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Corohmni

South Africa . 353 parts In-Stock

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Microchip USA

USA . 340 parts In-Stock

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Overview

Unleash the power of efficient power management with the CAT8710FTD-GT3 by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures optimal performance and seamless operation. Experience the value and benefits of this cutting-edge technology, providing customers with exceptional advantages and peace of mind. Elevate your power management solutions with Onsemi's innovative CAT8710FTD-GT3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good mechanical strength and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Nominal Supply Voltage (Vsup): 1.8 V

Suitable for applications requiring a stable supply voltage of 1.8V, ensuring proper functionality of connected devices.

No. of Terminals: 6

Sufficient number of terminals for connecting to other components and peripherals in a circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating reliably in low-temperature environments without any performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1mm, making it suitable for space-constrained applications.

Width (mm): 1.6 mm

Compact width of 1.6mm allows for efficient use of PCB space in tight layouts.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for power supply management applications, ensuring optimal performance and efficiency.

Adjustable Threshold: YES

Ability to adjust threshold levels provides flexibility in power management settings for different requirements.

Technical Specifications

Power Management ICs CAT8710FTD-GT3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.6 mm

Trade Compliance

CAT8710FTD-GT3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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