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CAT803JTBI-G

Onsemi

CAT803JTBI-G by Onsemi

CAT803JTBI-G by Onsemi is a Power Management IC with 3 terminals, Vsup of 5V, and operating temp range of -40 to 85 °C. It is a small outline package suitable for industrial applications requiring power supply support circuits. The IC has a low profile design with surface mount capability and terminal finish in Ni/Pd/Au for reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,294 parts In-Stock

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1,294

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Vyrian

USA . 1,186 parts In-Stock

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1,186

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 2 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

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10k+ parts

$0.179

2

$0.186

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-

$0.179

Northwest PG Solutions

USA . 2,174 parts In-Stock

1+ parts

$0.205

100+ parts

-

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$0.180

2,174

$0.205

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$0.180

Problanco Electronics

Mexico . 7,973 parts In-Stock

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7,973

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Kulean Microsystems

USA . 6,809 parts In-Stock

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6,809

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SupplyDigital Components

Austria . 6,327 parts In-Stock

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6,327

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TANS Electronics

Latvia . 2,921 parts In-Stock

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2,921

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Corphita

USA . 448 parts In-Stock

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448

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Corohmni

South Africa . 255 parts In-Stock

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UHIMA Technologies

Türkiye . 165 parts In-Stock

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165

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Overview

Elevate your power management solutions with the CAT803JTBI-G by Onsemi. Designed with top-quality materials and cutting-edge technology, this power supply support circuit offers unparalleled reliability and performance. Ideal for industrial applications, this small outline, low profile IC provides a nominal supply voltage of 5V and a wide operating temperature range. Trust Onsemi's expertise in power management ICs to deliver the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, saving space and enabling efficient PCB design.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V is commonly used in many electronic devices, ensuring compatibility with various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C enables the product to perform reliably under demanding conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function effectively in extreme cold environments.

Technical Specifications

Power Management ICs CAT803JTBI-G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.22 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.02 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.0V

Width (mm):

1.3 mm

Trade Compliance

CAT803JTBI-G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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