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CAT823RTDI-GT3

Onsemi

CAT823RTDI-GT3 by Onsemi

CAT823RTDI-GT3 by Onsemi is a Power Management IC with Vsup of 3V, suitable for industrial applications. It features a small outline package with 5 terminals and operates b/w -40 to 85°C. With a supply voltage range of 1.2-5.5V, it offers efficient power supply management in compact designs.

Median Price

$0.302

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Mouser Electronics

USA . 2,971 parts In-Stock

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$0.302

2,971

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Nova Conductors

Japan . 87 parts In-Stock

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$0.407

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$0.407

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Chip Stock

USA . 38,768 parts In-Stock

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Flip Electronics

USA . 15,000 parts In-Stock

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Vyrian

USA . 2,760 parts In-Stock

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Digiode

USA . 1,435 parts In-Stock

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Semicontronic

India . 2,925 parts In-Stock

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$0.257

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$0.251

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$0.249

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$0.249

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Ampacity Inc.

Singapore . 2,836 parts In-Stock

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$0.257

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Corohmni

South Africa . 398 parts In-Stock

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$0.302

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398

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Netroflash

USA . 2,000 parts In-Stock

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$0.407

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$0.407

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Argo Parts USA

USA . 1,372 parts In-Stock

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$0.407

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$0.395

1,372

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Continental Prestige Electronics

USA . 293 parts In-Stock

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$0.407

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$0.399

293

$0.407

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$0.399

Component Stockers USA

USA . 13,363 parts In-Stock

1+ parts

$0.890

100+ parts

$0.560

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$0.340

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$0.290

13,363

$0.890

$0.560

$0.340

$0.290

Modulus Dynamics

Lithuania . 5,407 parts In-Stock

1+ parts

$6.034

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$6.034

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$6.034

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5,407

$6.034

$6.034

$6.034

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Aztec Data Supply Inc.

USA . 208 parts In-Stock

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$15.347

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Kepictronics

USA . 306,000 parts In-Stock

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Perfect Parts

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Lixinc

USA . 9,010 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,179 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,119 parts In-Stock

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Kulean Microsystems

USA . 3,880 parts In-Stock

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TANS Electronics

Latvia . 3,617 parts In-Stock

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Problanco Electronics

Mexico . 1,391 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 748 parts In-Stock

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Microchip USA

USA . 620 parts In-Stock

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UHIMA Technologies

Türkiye . 556 parts In-Stock

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Overview

Discover the cutting-edge power management solution with the CAT823RTDI-GT3 by Onsemi. Crafted with precision and expertise, this small outline power supply management circuit offers unparalleled performance and reliability. Perfect for industrial applications, this IC boasts a wide operating temperature range and a compact design for seamless integration. Trust Onsemi to deliver top-quality products that exceed expectations. Elevate your projects with the CAT823RTDI-GT3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Surface Mount: YES

This feature allows for easy installation and integration into various electronic systems.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on circuit boards.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V makes this product compatible with a wide range of applications.

Power Supplies (V): 1.2/5.5

Support for power supplies ranging from 1.2V to 5.5V provides flexibility in design options.

No. of Terminals: 5

With 5 terminals, this product offers multiple connection points for enhanced functionality.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package make it suitable for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal positions offer versatility in terms of installation and connection options.

Maximum Seated Height: 1 mm

The low seated height of 1mm is ideal for applications with space constraints.

Width (mm): 1.6 mm

The narrow width of 1.6mm allows for easy installation in tight spaces.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This product's power supply management circuit ensures efficient and stable power distribution.

Minimum Supply Voltage (Vsup): 2 V

Support for a minimum supply voltage of 2V enables operation in low-power scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds helps prevent overheating during installation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure solder joints during assembly.

Length: 2.9 mm

The compact length of 2.9mm further contributes to space-saving design possibilities.

Nominal Threshold Voltage (V): +2.63V

The stable nominal threshold voltage of +2.63V ensures precise voltage regulation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for rugged industrial applications.

Maximum Supply Current (Isup): 0.012 mA

The low maximum supply current of 0.012mA helps conserve power in operation.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and secure connections.

Terminal Pitch: 0.95 mm

The tight terminal pitch of 0.95mm allows for high-density mounting on circuit boards.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safety margin for voltage spikes and fluctuations.

Technical Specifications

Power Management ICs CAT823RTDI-GT3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

CAT823RTDI-GT3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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