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BSS123-F169

Onsemi

BSS123-F169 by Onsemi

BSS123-F169 by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max power dissipation of 0.36W and operating temperature range from -55 to 150 °C, it offers reliable performance in various electronic circuits.

Median Price

$0.051

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 112,662 parts In-Stock

1+ parts

-

100+ parts

$0.051

1k+ parts

$0.043

10k+ parts

$0.038

112,662

-

$0.051

$0.043

$0.038

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 59 parts In-Stock

1+ parts

$0.038

100+ parts

-

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-

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59

$0.038

-

-

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Digiode

USA . 1,571 parts In-Stock

1+ parts

$0.040

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1,571

$0.040

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Vyrian

USA . 4,240 parts In-Stock

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4,240

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VNN

France . 657 parts In-Stock

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657

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 112,266 parts In-Stock

1+ parts

$0.036

100+ parts

-

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-

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112,266

$0.036

-

-

-

Semicontronic

India . 112,178 parts In-Stock

1+ parts

$0.036

100+ parts

$0.035

1k+ parts

$0.035

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-

112,178

$0.036

$0.035

$0.035

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$0.037

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238

$0.037

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Continental Prestige Electronics

USA . 2,211 parts In-Stock

1+ parts

$0.038

100+ parts

-

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$0.037

2,211

$0.038

-

-

$0.037

Argo Parts USA

USA . 1,318 parts In-Stock

1+ parts

$0.038

100+ parts

-

1k+ parts

-

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$0.036

1,318

$0.038

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-

$0.036

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.038

100+ parts

$0.037

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-

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50

$0.038

$0.037

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Corphita

USA . 2,260 parts In-Stock

1+ parts

$0.038

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2,260

$0.038

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Aztec Data Supply Inc.

USA . 181 parts In-Stock

1+ parts

$1.720

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181

$1.720

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AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$18.070

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679

$18.070

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SupplyDigital Components

Austria . 7,864 parts In-Stock

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7,864

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Problanco Electronics

Mexico . 7,605 parts In-Stock

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7,605

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TANS Electronics

Latvia . 6,940 parts In-Stock

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6,940

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Kulean Microsystems

USA . 6,063 parts In-Stock

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6,063

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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UHIMA Technologies

Türkiye . 964 parts In-Stock

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964

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Overview

Discover the power of the BSS123-F169 by Onsemi, a top-quality N-CHANNEL FET designed for switching applications. With a maximum DS breakdown voltage of 100V and a low on-resistance of 10 ohms, this transistor offers superior performance and reliability. Its small outline package and gull wing terminals make it ideal for surface mount applications, saving you valuable space and time during assembly. Trust in Onsemi's expertise in semiconductor technology to deliver a product that exceeds your expectations. Upgrade your designs with the BSS123-F169 and experience the difference in efficiency and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components, making this product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching operations, enhancing the performance of this transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and reliability in such operations.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, making this transistor suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle higher voltage levels, making it suitable for applications requiring higher power handling capabilities.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate in high temperature environments without compromising performance.

Maximum Drain Current (ID): 0.17 A

The maximum drain current of 0.17A allows for efficient power handling, making this FET suitable for applications requiring moderate current flow.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123-F169 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

10 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS123-F169 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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