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AMIS30621C6217RG

Onsemi

AMIS30621C6217RG by Onsemi

AMIS30621C6217RG by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 6.5-29V, and peak reflow temperature of 260 °C. Ideal for stepper motor control applications due to its compact size (12.77mm x 7.5mm) and low supply current (10mA).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 74,000 parts In-Stock

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Vyrian

USA . 4,584 parts In-Stock

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Digiode

USA . 1,468 parts In-Stock

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AZTECH Wire

Italy . 254 parts In-Stock

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$17.010

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Native Components

USA . 141 parts In-Stock

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$22.957

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Northwest PG Solutions

USA . 1,831 parts In-Stock

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$25.253

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$22.727

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Component Stockers USA

USA . 774 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 5,653 parts In-Stock

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Problanco Electronics

Mexico . 3,162 parts In-Stock

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Microchip USA

USA . 1,650 parts In-Stock

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Corphita

USA . 1,076 parts In-Stock

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Kulean Microsystems

USA . 997 parts In-Stock

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TANS Electronics

Latvia . 995 parts In-Stock

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Kepictronics

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Corohmni

South Africa . 448 parts In-Stock

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UHIMA Technologies

Türkiye . 269 parts In-Stock

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Overview

Experience the next level of motion control with the AMIS30621C6217RG by Onsemi. Crafted with precision and expertise, this high-quality Motion Control IC offers unparalleled performance in a compact package. Ideal for a wide range of applications, from robotics to automation, this IC provides seamless operation and precise control. Trust in Onsemi's reputation for excellence and innovation, and unlock the full potential of your projects with the AMIS30621C6217RG. Elevate your designs with the superior quality and reliability that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IC lightweight and durable, ensuring longevity and reliability in various applications.

Surface Mount: YES

Being surface mount enables easy and efficient installation onto circuit boards, saving time and space in the design process.

Nominal Supply Voltage (Vsup): 8 V

The nominal supply voltage of 8V provides a stable power source for the IC to operate efficiently within the specified parameters.

No. of Terminals: 20

Having 20 terminals allows for the IC to interface with other components and devices, expanding its functionality and versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact designs and applications with limited space.

Maximum Supply Current (Isup): 10 mA

With a low maximum supply current requirement, the IC is energy-efficient and can be powered by a variety of power sources without excessive power consumption.

Technical Specifications

Motion Control ICs AMIS30621C6217RG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.77 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

AMIS30621C6217RG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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