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AMIS30621C6216G

Onsemi

AMIS30621C6216G by Onsemi

AMIS30621C6216G by Onsemi is a Motion Control IC with 32 terminals, operating voltage range of 6.5-29V, and peak reflow temperature of 260 °C. Ideal for stepper motor control applications due to its compact square package shape and low supply current requirement.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 30,000 parts In-Stock

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Vyrian

USA . 11,673 parts In-Stock

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Digiode

USA . 2,287 parts In-Stock

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Native Components

USA . 896 parts In-Stock

1+ parts

$14.271

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896

$14.271

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AZTECH Wire

Italy . 747 parts In-Stock

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$14.750

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747

$14.750

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Northwest PG Solutions

USA . 527 parts In-Stock

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$15.699

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$14.129

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527

$15.699

$14.129

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Microchip USA

USA . 1,888 parts In-Stock

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$17.697

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$17.697

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Component Stockers USA

USA . 1,942 parts In-Stock

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$61.790

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$61.790

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Problanco Electronics

Mexico . 7,895 parts In-Stock

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Kulean Microsystems

USA . 2,596 parts In-Stock

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SupplyDigital Components

Austria . 2,196 parts In-Stock

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Corphita

USA . 1,246 parts In-Stock

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UHIMA Technologies

Türkiye . 863 parts In-Stock

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Corohmni

South Africa . 266 parts In-Stock

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TANS Electronics

Latvia . 112 parts In-Stock

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Overview

Experience seamless motion control with the AMIS30621C6216G by Onsemi. Crafted with precision and quality, this motion control IC is designed to elevate your applications to new heights. Whether you're working on robotics, automation, or 3D printing, this product offers unparalleled value, benefits, and advantages to ensure smooth operations and optimal performance. Trust Onsemi for top-of-the-line technology that delivers results you can rely on.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and improving overall reliability.

Package Shape: SQUARE

Square packages are known for their compact size and efficient use of space, making the product suitable for applications where size is a critical factor.

Nominal Supply Voltage (Vsup): 8 V

The specified supply voltage ensures the proper functioning of the motion control IC, providing a stable power source for consistent performance.

Power Supplies (V): 6.5/29

With a wide range of supported power supplies, this IC can be used in various applications and environments, offering flexibility and compatibility.

No. of Terminals: 32

The high number of terminals allows for versatile connectivity options and integration with different components, enhancing the functionality and usability of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation, compact design, and compatibility with various mounting configurations.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, enhancing the durability and reliability of the product.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections, reducing the risk of signal interference or disconnection, ensuring stable operation.

Width (mm): 7 mm

The narrow width of 7mm makes the IC suitable for installations in tight spaces or compact devices, increasing versatility and integration possibilities.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller, this IC is ideal for precise motion control applications, offering smooth and accurate movement in various automation and robotics systems.

Minimum Supply Voltage (Vsup): 6.5 V

The specified minimum supply voltage ensures compatibility with a wide range of power sources, enabling reliable performance even under fluctuating power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum reflow time ensures proper soldering and assembly of the IC, preventing damage or degradation during the manufacturing process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the IC can withstand the soldering process without overheating or losing its electrical properties, ensuring manufacturing reliability.

Length: 7 mm

The compact length of 7mm makes the IC suitable for compact designs and applications where space is limited, offering flexibility in installation and integration.

Maximum Supply Current (Isup): 10 mA

With a low maximum supply current requirement of 10mA, the IC can operate efficiently without drawing excessive power, promoting energy efficiency and reducing operating costs.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and reduces the risk of solder joint failure, improving the overall reliability and durability of the product.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for close spacing of terminals, enabling high-density PCB layouts and compact designs, enhancing the versatility and efficiency of the IC.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates that the IC has moderate sensitivity to moisture, requiring appropriate handling and storage to prevent damage, ensuring long-term reliability and performance.

Maximum Supply Voltage (Vsup): 29 V

The specified maximum supply voltage of 29V provides a wide operating range for the IC, accommodating various power sources and input voltages, offering flexibility in different applications.

Technical Specifications

Motion Control ICs AMIS30621C6216G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

AMIS30621C6216G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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