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74LVC574ADTR2G

Onsemi

74LVC574ADTR2G by Onsemi

74LVC574ADTR2G by Onsemi is an 8-bit bus driver with a supply voltage of 3.3V, featuring a propagation delay of 15.1ns and operating temperature range from -40 to 125 °C. Ideal for automotive applications due to its CMOS technology, small form factor, and dual terminal position.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48,336 parts In-Stock

1+ parts

-

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$0.132

1k+ parts

$0.110

10k+ parts

$0.098

48,336

-

$0.132

$0.110

$0.098

Verical

USA . 48,336 parts In-Stock

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$0.122

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$0.122

Distributors (In-Stock)

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Digiode

USA . 1,351 parts In-Stock

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$0.103

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1,351

$0.103

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Vyrian

USA . 3,891 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 207 parts In-Stock

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$0.095

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207

$0.095

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Corphita

USA . 2,384 parts In-Stock

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$0.097

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2,384

$0.097

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Component Stockers USA

USA . 51,405 parts In-Stock

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$0.110

100+ parts

$0.100

1k+ parts

$0.090

10k+ parts

$0.090

51,405

$0.110

$0.100

$0.090

$0.090

AZTECH Wire

Italy . 833 parts In-Stock

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$20.100

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833

$20.100

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Continental Prestige Electronics

USA . 48,336 parts In-Stock

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$0.130

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48,336

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$0.130

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TANS Electronics

Latvia . 8,069 parts In-Stock

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Problanco Electronics

Mexico . 6,985 parts In-Stock

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SupplyDigital Components

Austria . 2,969 parts In-Stock

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Kulean Microsystems

USA . 2,070 parts In-Stock

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Northwest PG Solutions

USA . 1,734 parts In-Stock

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Native Components

USA . 594 parts In-Stock

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UHIMA Technologies

Türkiye . 481 parts In-Stock

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Microchip USA

USA . 448 parts In-Stock

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Overview

Unlock the power of seamless communication with the 74LVC574ADTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This bus driver & transceiver is perfect for a wide range of applications, offering unmatched performance and durability. Experience the value of efficient signal transmission and enhanced connectivity with this innovative product. Trust Onsemi to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of systems and applications.

Propagation Delay (tpd): 15.1 ns

Fast propagation delay ensures quick signal transmission, reducing latency and improving overall efficiency.

Temperature Grade: AUTOMOTIVE

Automotive-grade ensures reliability and performance under harsh operating conditions, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74LVC574ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

15.1 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC574ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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