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74FST3253DR2

Onsemi

74FST3253DR2 by Onsemi

74FST3253DR2 by Onsemi is a Bus Driver & Transceiver with 2 functions, 4 bits, and 5V nominal voltage. It has a propagation delay of 0.25ns and operates in industrial temperature range. Ideal for bidirectional communication applications requiring true output polarity and low enable control.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26,900 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

26,900

-

$0.225

$0.186

$0.166

Verical

USA . 16,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.208

16,900

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,176 parts In-Stock

1+ parts

$0.175

100+ parts

-

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-

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2,176

$0.175

-

-

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Vyrian

USA . 6,961 parts In-Stock

1+ parts

-

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-

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6,961

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$0.160

-

-

-

Corphita

USA . 1,809 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,809

$0.166

-

-

-

Component Stockers USA

USA . 32,770 parts In-Stock

1+ parts

$0.190

100+ parts

$0.180

1k+ parts

$0.160

10k+ parts

$0.160

32,770

$0.190

$0.180

$0.160

$0.160

Andel Nordic

Denmark . 515 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

$0.368

10k+ parts

$0.368

515

$0.530

-

$0.368

$0.368

AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$11.690

100+ parts

-

1k+ parts

-

10k+ parts

-

621

$11.690

-

-

-

Native Components

USA . 786 parts In-Stock

1+ parts

$211.650

100+ parts

-

1k+ parts

-

10k+ parts

$203.184

786

$211.650

-

-

$203.184

Northwest PG Solutions

USA . 87 parts In-Stock

1+ parts

$232.815

100+ parts

-

1k+ parts

-

10k+ parts

-

87

$232.815

-

-

-

Continental Prestige Electronics

USA . 26,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.165

10k+ parts

-

26,900

-

-

$0.165

-

TANS Electronics

Latvia . 5,572 parts In-Stock

1+ parts

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100+ parts

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5,572

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SupplyDigital Components

Austria . 3,563 parts In-Stock

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3,563

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UHIMA Technologies

Türkiye . 818 parts In-Stock

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818

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Problanco Electronics

Mexico . 713 parts In-Stock

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713

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Microchip USA

USA . 401 parts In-Stock

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401

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Kulean Microsystems

USA . 258 parts In-Stock

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258

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$8.322

1k+ parts

$7.706

10k+ parts

$7.706

150

-

$8.322

$7.706

$7.706

Overview

Elevate your circuit design with the 74FST3253DR2 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality bus driver & transceivers that are reliable and efficient. This versatile product offers customers a seamless experience with its advanced technology and high-performance capabilities. Perfect for applications requiring fast and accurate data transmission, the 74FST3253DR2 ensures optimal signal integrity and minimal power consumption. Experience the value and benefits of this innovative solution in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making it suitable for use in various environments.

Surface Mount: YES

Surface mount design allows for easy installation and integration into electronic circuit boards.

No. of Functions: 2

Having 2 functions allows for versatility and flexibility in circuit design.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to fit into compact spaces on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50pF, this product can effectively drive connected loads without experiencing signal degradation.

Power Supplies (V): 5

Operating at a power supply voltage of 5V ensures stable performance in most applications.

No. of Terminals: 16

Having 16 terminals allows for multiple connection options and increased functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for compact designs.

Propagation Delay (tpd): 0.25 ns

Low propagation delay of 0.25ns ensures fast signal transmission and response times.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperature environments.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for high impedance state when not actively driving a signal, reducing power consumption.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C ensures functionality in cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability in various soldering processes.

Terminal Position: DUAL

Dual terminal position offers multiple connection options and ensures secure mounting on the circuit board.

No. of Ports: 5

Having 5 ports allows for multiple input and output connections, increasing versatility in circuit design.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75mm minimizes space requirements on the circuit board.

Width: 3.9 mm

Narrow width of 3.9mm saves space on the circuit board, enabling compact designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 4 V

Operating at a minimum supply voltage of 4V ensures continuous operation even with fluctuating power supplies.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235 °C, this product can withstand high-temperature soldering processes.

Length: 9.9 mm

Compact length of 9.9mm saves space on the circuit board, enabling efficient use of board real estate.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Packing Method: TR

TR packing method ensures secure packaging and handling during transportation and storage.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product offers compatibility with standard PCB layouts.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for versatile signal transmission and detection.

Control Type: ENABLE LOW

Enable low control type ensures easy activation and deactivation of the device for efficient power management.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V ensures safe operation within specified voltage limits.

No. of Outputs: 4

Having 4 outputs allows for multiple signal pathways and increased functionality in circuit design.

Technical Specifications

Bus Driver & Transceivers 74FST3253DR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

1

No. of Outputs:

4

No. of Ports:

5

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74FST3253DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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