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2SK544E

Onsemi

2SK544E by Onsemi

The Onsemi 2SK544E is an N-CHANNEL RF FET with a max drain current of 0.03A, operating in DEPLETION MODE for AMPLIFIER applications. It features METAL-OXIDE SEMICONDUCTOR tech and operates in the VERY HIGH FREQUENCY BAND, making it ideal for high-frequency signal amplification in various electronic devices.

Median Price

$0.076

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 4,279 parts In-Stock

1+ parts

$0.076

100+ parts

$0.071

1k+ parts

$0.064

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4,279

$0.076

$0.071

$0.064

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Distributors (In-Stock)

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Digiode

USA . 836 parts In-Stock

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$0.072

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836

$0.072

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Vyrian

USA . 1,332 parts In-Stock

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$0.076

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1,332

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DigiKey Marketplace

USA . 4,279 parts In-Stock

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4,279

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ACDS - Activité Composants Distribution Service

France . 987 parts In-Stock

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987

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GES GmbH

Germany . 63 parts In-Stock

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LittleDiode

UK . 11 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 368 parts In-Stock

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$0.053

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$0.051

368

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$0.051

Corphita

USA . 333 parts In-Stock

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$0.068

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333

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Corohmni

South Africa . 63 parts In-Stock

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$0.076

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63

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QUARKTWIN TECHNOLOGY LTD

USA . 24,241 parts In-Stock

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Problanco Electronics

Mexico . 6,814 parts In-Stock

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Kulean Microsystems

USA . 5,390 parts In-Stock

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SupplyDigital Components

Austria . 3,097 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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TANS Electronics

Latvia . 1,530 parts In-Stock

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UHIMA Technologies

Türkiye . 713 parts In-Stock

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713

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Northwest PG Solutions

USA . 307 parts In-Stock

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307

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Overview

Enhance your electronic projects with the high-quality 2SK544E RF Small Signal Field Effect Transistor by Onsemi. This N-channel transistor offers unparalleled performance and reliability, making it ideal for amplifier applications in the very high frequency band. With a plastic/epoxy package body and a single configuration, this transistor is designed to deliver exceptional results. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the 2SK544E - the perfect choice for all your amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics such as lower ON resistance and higher efficiency compared to P-Channel transistors.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes it easier to integrate into electronic devices.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards and facilitates space-saving designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and are well suited for applications where durability is important.

Operating Mode: DEPLETION MODE

Depletion mode transistors offer simplicity in circuit design and can be used for a variety of applications including signal switching.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliable operation in various applications.

Transistor Element Material: SILICON

Silicon transistors provide good thermal stability, high breakdown voltage, and low leakage current for efficient operation.

Terminal Finish: Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

The terminal finish enhances solderability and conductivity, ensuring reliable electrical connections.

Maximum Drain Current (ID): 0.03 A

With a maximum drain current of 0.03 A, this transistor can handle moderate power levels and is suitable for many low-power applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and makes it easy to connect to other components in the circuit.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) 2SK544E attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOW NOISE

Configuration:

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2SK544E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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