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2N7002WT3G

Onsemi

2N7002WT3G by Onsemi

2N7002WT3G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.31A Drain Current, and 1.6 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with built-in diode and resistor. Operates in ENHANCEMENT MODE at max temp of 150°C, making it suitable for various electronic devices.

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4

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1k+

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Vyrian

USA . 9,414 parts In-Stock

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Digiode

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Nova Conductors

Japan . 700 parts In-Stock

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AZTECH Wire

Italy . 853 parts In-Stock

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Ampacity Inc.

Singapore . 446 parts In-Stock

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$55.050

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SupplyDigital Components

Austria . 7,925 parts In-Stock

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Kulean Microsystems

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Argo Parts USA

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TANS Electronics

Latvia . 2,355 parts In-Stock

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Continental Prestige Electronics

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Problanco Electronics

Mexico . 2,130 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 940 parts In-Stock

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Overview

Upgrade your electronic devices with the 2N7002WT3G by Onsemi, a high-quality Small Signal Field Effect Transistor (FET) that promises reliable performance and durability. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL transistor is perfect for switching applications. With built-in diode and resistor, it offers convenience and efficiency, making it a valuable choice for your projects. Whether you're a hobbyist or a professional, the 2N7002WT3G delivers exceptional benefits and advantages, ensuring smooth operation and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and faster switching speeds, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and save space on the PCB, making this transistor a convenient choice for designers.

Transistor Application: SWITCHING

Designed for switching applications, this transistor provides fast and efficient switching capabilities.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this transistor ideal for mass production.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and soldering on the PCB, improving the overall reliability of the circuit.

Maximum Drain Current (Abs) (ID): 0.31 A

With a maximum drain current of 0.31 A, this transistor can handle moderate current loads, making it versatile for various applications.

Maximum Power Dissipation (Abs): 0.33 W

The low power dissipation helps in reducing heat generation and improving the overall efficiency of the circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this transistor suitable for critical applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand higher temperatures, making it suitable for industrial applications.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, ensuring stable operation in a wide range of conditions.

Terminal Finish: TIN

The tin finish provides good conductivity and solderability, ensuring reliable connections on the PCB.

Maximum Drain-Source On Resistance: 1.6 ohm

The low on-resistance ensures minimal power loss and efficient operation in switching applications.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes, ensuring reliability during assembly.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N7002WT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.31 A

Maximum Drain Current (ID):

.31 A

Maximum Drain-Source On Resistance:

1.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N7002WT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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