Loading...

2N7002LT7H

Onsemi

2N7002LT7H by Onsemi

2N7002LT7H by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 7.5 ohm RDS(on), and 115mA ID. Ideal for small outline applications requiring an Enhancement Mode MOSFET with built-in diode in a surface-mount package. Operating range from -55 to 150 °C makes it suitable for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,157

-

-

-

-

Digiode

USA . 1,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,599

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 742 parts In-Stock

1+ parts

$19.530

100+ parts

-

1k+ parts

-

10k+ parts

-

742

$19.530

-

-

-

Native Components

USA . 200 parts In-Stock

1+ parts

$94.669

100+ parts

-

1k+ parts

-

10k+ parts

$90.883

200

$94.669

-

-

$90.883

Northwest PG Solutions

USA . 1,126 parts In-Stock

1+ parts

$104.136

100+ parts

-

1k+ parts

-

10k+ parts

-

1,126

$104.136

-

-

-

TANS Electronics

Latvia . 6,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,421

-

-

-

-

SupplyDigital Components

Austria . 6,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,407

-

-

-

-

Kulean Microsystems

USA . 5,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,920

-

-

-

-

Problanco Electronics

Mexico . 5,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,117

-

-

-

-

UHIMA Technologies

Türkiye . 715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

715

-

-

-

-

Corohmni

South Africa . 356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

356

-

-

-

-

Corphita

USA . 162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

162

-

-

-

-

Overview

Unleash the power of innovation with the 2N7002LT7H by Onsemi! Crafted with precision and expertise, this Small Signal Field Effect Transistor offers unparalleled quality and performance. With its N-CHANNEL configuration and built-in diode, this product is a game-changer in various applications. From enhancing circuit efficiency to maximizing power management, the possibilities are endless. Trust Onsemi for cutting-edge technology and reliability, and elevate your projects to new heights with the 2N7002LT7H!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the small signal FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can withstand higher voltages without breakdown, making it suitable for various applications.

Maximum Drain Current (ID): 0.115 A

The high maximum drain current allows for better performance and handling of current in the circuit.

Maximum Drain-Source On Resistance: 7.5 ohm

Low drain-source on resistance leads to less power dissipation and improved efficiency in the circuit.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N7002LT7H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.115 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

2N7002LT7H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20