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2N5457G

Onsemi

2N5457G by Onsemi

2N5457G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage. Ideal for SWITCHING applications, it operates in DEPLETION MODE with 3 terminals and 0.31W power dissipation. With a max operating temperature of 150°C, it features a feedback capacitance of 3pF and uses Tin/Silver/Copper terminal finish.

Median Price

$0.868

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 39 parts In-Stock

1+ parts

$0.868

100+ parts

$0.825

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$0.825

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39

$0.868

$0.825

$0.825

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Distributors (In-Stock)

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Digiode

USA . 2,124 parts In-Stock

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$0.825

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Vyrian

USA . 5,438 parts In-Stock

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5,438

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VNN

France . 3,458 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Prism Electronics

USA . 12 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 39 parts In-Stock

1+ parts

$0.740

100+ parts

$0.722

1k+ parts

$0.718

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39

$0.740

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$0.718

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Ampacity Inc.

Singapore . 14 parts In-Stock

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$0.740

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14

$0.740

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Corphita

USA . 2,255 parts In-Stock

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$0.781

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Corohmni

South Africa . 118 parts In-Stock

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$0.868

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118

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Advanced Electronics

New Zealand . 39 parts In-Stock

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$0.868

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$0.825

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$0.825

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39

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$0.825

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Aztec Data Supply Inc.

USA . 4,713 parts In-Stock

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$0.983

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AZTECH Wire

Italy . 712 parts In-Stock

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$7.136

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712

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Component Stockers USA

USA . 526 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 4,857 parts In-Stock

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SupplyDigital Components

Austria . 2,868 parts In-Stock

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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2,780

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Kulean Microsystems

USA . 2,419 parts In-Stock

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TANS Electronics

Latvia . 1,592 parts In-Stock

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Continental Prestige Electronics

USA . 1,568 parts In-Stock

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UHIMA Technologies

Türkiye . 510 parts In-Stock

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510

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Bastille Electronics

Australia . 100 parts In-Stock

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Argo Parts USA

USA . 25 parts In-Stock

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Perfect Parts

USA . 13 parts In-Stock

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Overview

Unleash the power of innovation with the 2N5457G by Onsemi. This high-quality Small Signal Field Effect Transistor (FET) offers unparalleled performance and reliability in switching applications. With Onsemi's reputation for excellence and the versatile capabilities of this N-CHANNEL transistor, customers can trust in its value and benefits for their projects. Whether you're a seasoned professional or a DIY enthusiast, the 2N5457G delivers the precision and efficiency you need to take your designs to the next level. Elevate your electronics with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in a variety of operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-state resistance and higher transconductance, making them efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast on/off transitions and efficient operation.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25 V, this transistor can handle higher voltages without breaking down, ensuring reliability.

Operating Mode: DEPLETION MODE

Depletion mode transistors have inherent voltage control, which can be advantageous in certain circuit designs.

Maximum Power Dissipation: 0.31 W

With a maximum power dissipation of 0.31 W, this transistor can handle relatively high power levels without overheating.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150°C, suitable for a wide range of environments and applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low output impedance, making it suitable for high-frequency applications.

Maximum Feedback Capacitance: 3 pF

Low feedback capacitance helps reduce signal distortion and improve overall performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N5457G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOW NOISE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

3 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N5457G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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