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0W888-002-XTP

Onsemi

0W888-002-XTP by Onsemi

The Onsemi 0W888-002-XTP is a DSP with max clock freq of 50MHz, low power mode, and barrel shifter. Ideal for industrial applications requiring digital signal processing capabilities in a compact package. Operates b/w -40 to 85 °C with supply voltage range of 0.9V to 2V.

Median Price

$19.940

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 214 parts In-Stock

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$19.940

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214

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$19.940

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Vyrian

USA . 2,353 parts In-Stock

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2,353

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Digiode

USA . 1,652 parts In-Stock

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Bristol Electronics

USA . 1,285 parts In-Stock

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1,285

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Distributors (Availability)

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Native Components

USA . 934 parts In-Stock

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$0.569

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934

$0.569

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Northwest PG Solutions

USA . 1,725 parts In-Stock

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$0.626

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1,725

$0.626

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Corohmni

South Africa . 322 parts In-Stock

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$19.170

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322

$19.170

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Component Stockers USA

USA . 293 parts In-Stock

1+ parts

$19.750

100+ parts

$18.570

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293

$19.750

$18.570

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Perfect Parts

USA . 59,752 parts In-Stock

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SupplyDigital Components

Austria . 6,549 parts In-Stock

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TANS Electronics

Latvia . 6,495 parts In-Stock

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GreenTree Electronics

Israel . 5,975 parts In-Stock

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Kulean Microsystems

USA . 4,946 parts In-Stock

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Corphita

USA . 2,432 parts In-Stock

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Problanco Electronics

Mexico . 1,918 parts In-Stock

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Microchip USA

USA . 1,138 parts In-Stock

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UHIMA Technologies

Türkiye . 598 parts In-Stock

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Continental Prestige Electronics

USA . 262 parts In-Stock

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$13.860

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262

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$13.860

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Overview

Elevate your digital signal processing capabilities with the 0W888-002-XTP by Onsemi. Manufactured with precision and expertise, this DSP offers unparalleled performance and reliability for a wide range of applications. From audio processing to image recognition, this product is designed to deliver exceptional value, efficiency, and versatility. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference with the 0W888-002-XTP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, making it ideal for portable devices or applications where weight is a concern.

Surface Mount: YES

Having a surface mount option makes it easier for manufacturers to assemble the product onto circuit boards, saving space and reducing overall production cost.

Maximum Supply Voltage: 2 V

The high maximum supply voltage allows for flexibility in power requirements, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, helping to optimize the overall design and layout.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with other components or peripherals, enabling versatile functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration, allowing for compact designs and efficient signal processing.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage helps to reduce power consumption, making the product suitable for battery-powered applications or energy-efficient designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in harsh environmental conditions or industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments or during temperature fluctuations.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy assembly and soldering onto circuit boards, streamlining the manufacturing process.

Maximum Seated Height: 1.5 mm

The low maximum seated height helps to maintain a slim profile, enabling the product to fit in compact spaces or slim devices.

Width: 7 mm

The moderate width allows for efficient placement on a circuit board while also providing enough space for routing signals and connections.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency enables fast signal processing and data handling, contributing to the product's high performance capabilities.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data transfer efficiency and processing speed, leading to improved overall performance.

Length: 7 mm

With a compact length, the product can be easily integrated into tight spaces or small form factor devices without compromising functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand rugged conditions and operate reliably in demanding industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed digital signal processor type allows for versatile signal processing capabilities, making the product suitable for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast operation, making the product efficient and reliable for various applications.

Terminal Form: BALL

The ball terminal form provides secure connections and ease of soldering, ensuring reliable electrical connections for optimum performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V strikes a balance between power efficiency and performance, making the product suitable for a wide range of applications.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for high-density packaging and precise signal routing, enhancing the product's overall efficiency and performance.

Format: FIXED POINT

The fixed point format simplifies arithmetic operations and enhances computational efficiency, making the product well-suited for signal processing tasks.

Low Power Mode: YES

The availability of a low power mode helps to conserve energy and extend battery life, making the product efficient for portable or battery-powered devices.

Barrel Shifter: YES

The presence of a barrel shifter enhances data manipulation and arithmetic operations, improving the product's computational capabilities and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) 0W888-002-XTP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT NOMINAL 1.25V

Address Bus Width:

0

Barrel Shifter:

YES

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B64

Length:

7 mm

Low Power Mode:

YES

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

0W888-002-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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