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0W344-005-XTP

Onsemi

0W344-005-XTP by Onsemi

Onsemi 0W344-005-XTP is a 16-bit DSP with max clock freq of 33 MHz, RAM words of 8192, and operates in industrial temp range. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,517 parts In-Stock

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4,517

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Digiode

USA . 1,720 parts In-Stock

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1,720

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Distributors (Availability)

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AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$18.030

100+ parts

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803

$18.030

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Advanced Electronics

New Zealand . 67 parts In-Stock

1+ parts

$33.451

100+ parts

$30.440

1k+ parts

$27.430

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67

$33.451

$30.440

$27.430

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Corohmni

South Africa . 619 parts In-Stock

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$34.070

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619

$34.070

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Component Stockers USA

USA . 553 parts In-Stock

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$99.990

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553

$99.990

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TANS Electronics

Latvia . 7,044 parts In-Stock

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7,044

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SupplyDigital Components

Austria . 5,696 parts In-Stock

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5,696

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Problanco Electronics

Mexico . 3,106 parts In-Stock

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Northwest PG Solutions

USA . 2,278 parts In-Stock

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$3.871

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2,278

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$3.871

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Corphita

USA . 1,787 parts In-Stock

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1,787

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Kulean Microsystems

USA . 1,097 parts In-Stock

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1,097

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Native Components

USA . 397 parts In-Stock

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$3.832

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397

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$3.832

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Microchip USA

USA . 257 parts In-Stock

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UHIMA Technologies

Türkiye . 160 parts In-Stock

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Overview

Unlock the power of digital signal processing with the 0W344-005-XTP by Onsemi. Manufactured by industry leader Onsemi, this high-quality DSP offers unparalleled performance and reliability in a compact square package. Ideal for a wide range of applications, this DSP boasts a 16-bit size, 8192 RAM words, and a maximum clock frequency of 33 MHz. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile chip carrier with heat sink/slug package will exceed your expectations. Experience the value and benefits of Onsemi's cutting-edge technology with the 0W344-005-XTP.

Feature Benefit Bullets

Surface Mount YES

Surface mount technology allows for easy assembly onto printed circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage 1.8 V

Higher maximum supply voltage ensures compatibility with a wide range of power sources, increasing overall flexibility.

Package Shape SQUARE

Square package shape provides stability and efficient use of space, making it easier to integrate into different systems.

Bit Size 16

16-bit processing capability allows for higher precision and more complex signal processing tasks, resulting in better performance.

Power Supplies (V) 1.25

Stable power supply voltage of 1.25V ensures reliable and consistent operation of the DSP.

No. of Terminals 52

With a high number of terminals, the DSP can interface with a wide range of inputs and outputs, increasing its versatility.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG

The package style with chip carrier and heat sink/slug design helps in efficient heat dissipation, ensuring optimal performance of the DSP.

Minimum Supply Voltage 1.03 V

Low minimum supply voltage allows for efficient power consumption, extending the battery life of devices powered by the DSP.

Maximum Operating Temperature 85 °C

High maximum operating temperature makes the DSP suitable for industrial environments where heat tolerance is crucial.

Minimum Operating Temperature -40 °C

Low minimum operating temperature allows the DSP to function reliably even in extreme cold conditions.

Terminal Finish TIN

Tin terminal finish provides good electrical conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position QUAD

Quad terminal position allows for easy soldering and secure mounting on the PCB, simplifying the assembly process.

Maximum Seated Height 1.1 mm

Low maximum seated height reduces the overall profile of the DSP, making it suitable for compact and slim devices.

RAM Words 8192

Large RAM capacity of 8192 words enables the DSP to store and process a significant amount of data, enhancing its functionality.

Width 8 mm

Compact width of 8mm allows for easy integration into space-constrained applications without sacrificing performance.

Maximum Clock Frequency 33 MHz

High maximum clock frequency of 33MHz enables the DSP to process signals quickly and efficiently, improving overall speed of operation.

Peak Reflow Temperature °C 260

High peak reflow temperature of 260 °C ensures reliable soldering during assembly, enhancing the durability of the product.

Internal Bus Architecture MULTIPLE

Multiple internal bus architecture enhances data transfer speeds and efficiency, resulting in faster signal processing and improved performance.

Length 8 mm

Compact length of 8mm allows for easy integration and placement of the DSP in various electronic devices.

Temperature Grade INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with extreme temperatures, making it suitable for industrial applications.

Peripheral IC Type DIGITAL SIGNAL PROCESSOR, MIXED

Peripheral IC type with digital signal processor and mixed capabilities provides versatile functionality for a wide range of signal processing tasks.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Terminal Form NO LEAD

No lead terminal form complies with environmental regulations and reduces the environmental impact of the product.

Nominal Supply Voltage 1.25 V

Stable nominal supply voltage of 1.25V ensures consistent and reliable performance of the DSP in various applications.

Terminal Pitch 0.5 mm

Small terminal pitch of 0.5mm allows for high-density mounting on PCBs, saving space and enabling compact device designs.

Format FIXED POINT

Fixed-point format simplifies signal processing tasks and reduces computational complexity, resulting in efficient performance.

Barrel Shifter YES

Barrel shifter capability allows for efficient shifting of data and complex arithmetic operations, enhancing the DSP's processing speed and versatility.

Technical Specifications

Digital Signal Processors (DSPs) 0W344-005-XTP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Onsemi

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

NO

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.8 V

Minimum Supply Voltage:

1.03 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Trade Compliance

0W344-005-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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