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0W344-004-XTP

Onsemi

0W344-004-XTP by Onsemi

Onsemi 0W344-004-XTP is a 16-bit DSP with max. supply voltage of 1.8V, operating temp. range -40 to 85 °C, and clock frequency up to 33MHz. Ideal for industrial applications requiring high-speed digital signal processing in compact form factor with square package shape and no lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,525 parts In-Stock

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5,525

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Digiode

USA . 241 parts In-Stock

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241

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Distributors (Availability)

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Native Components

USA . 91 parts In-Stock

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$0.412

100+ parts

-

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$0.396

91

$0.412

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$0.396

Northwest PG Solutions

USA . 1,699 parts In-Stock

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$0.454

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$0.400

1,699

$0.454

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$0.400

AZTECH Wire

Italy . 865 parts In-Stock

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$9.180

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865

$9.180

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Perfect Parts

USA . 31,668 parts In-Stock

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31,668

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SupplyDigital Components

Austria . 7,659 parts In-Stock

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7,659

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Problanco Electronics

Mexico . 7,428 parts In-Stock

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Kulean Microsystems

USA . 7,327 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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TANS Electronics

Latvia . 1,566 parts In-Stock

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Corphita

USA . 713 parts In-Stock

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713

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Corohmni

South Africa . 443 parts In-Stock

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Microchip USA

USA . 420 parts In-Stock

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UHIMA Technologies

Türkiye . 96 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock the power of cutting-edge technology with the 0W344-004-XTP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Digital Signal Processors that are perfect for a wide range of applications. From advanced digital audio processing to industrial automation, this DSP offers unmatched performance and reliability. With features like a maximum clock frequency of 33 MHz and a compact square package shape, the 0W344-004-XTP provides exceptional value and benefits to customers looking for high-performance solutions. Experience the advantage of superior technology with Onsemi's innovative DSPs.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount technology allows for easy and efficient assembly of the product onto a printed circuit board, reducing manufacturing costs and improving reliability.

Maximum Supply Voltage: 1.8 V

Operates efficiently with a low maximum supply voltage, reducing power consumption and heat generation.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB, allowing for compact designs in electronic devices.

Bit Size: 16

16-bit processing capability allows for handling of complex digital signal processing tasks with precision and efficiency.

Power Supplies (V): 1.25

Stable power supply at 1.25V ensures consistent performance of the DSP, making it reliable in various applications.

No. of Terminals: 52

Large number of terminals enable versatile connectivity options and interfaces with other components in the system.

Minimum Supply Voltage: 1.03 V

Low minimum supply voltage requirement allows for operation even in low power scenarios, making it energy-efficient.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide temperature range support allows the DSP to function in extreme cold conditions, suitable for various industrial applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, facilitating easy and reliable connections during assembly.

RAM Words: 8192

Ample RAM capacity of 8192 words enables efficient storage and processing of data for complex signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) 0W344-004-XTP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Onsemi

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.8 V

Minimum Supply Voltage:

1.03 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

0W344-004-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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