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SC16IS752IPW

NXP Semiconductors

SC16IS752IPW by NXP Semiconductors

SC16IS752IPW by NXP Semiconductors is a Serial Communication Controller with 2 address bus width, operating at 80 MHz clock frequency. It has a max data transfer rate of 0.625 MBps and supports asynchronous communication protocol. Ideal for industrial applications requiring low power mode and dual serial I/Os.

Median Price

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Lifecycle Status

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13

In-Stock Inventory

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Chip Stock

USA . 29,000 parts In-Stock

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Flip Electronics

USA . 7,611 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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Anansix

USA . 2,255 parts In-Stock

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Digiode

USA . 1,283 parts In-Stock

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Vyrian

USA . 580 parts In-Stock

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580

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Martec Srl

Italy . 525 parts In-Stock

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First Choice Components Inc.

USA . 149 parts In-Stock

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149

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Nova Conductors

Japan . 98 parts In-Stock

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Microfarads

USA . 63 parts In-Stock

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ComSIT Distribution GmbH

Germany . 59 parts In-Stock

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Speed Components Ltd

Israel . 30 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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AZTECH Wire

Italy . 291 parts In-Stock

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$5.440

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Ampacity Inc.

Singapore . 1,125 parts In-Stock

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$13.000

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One Stop Electronics

USA . 1,133 parts In-Stock

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Corohmni

South Africa . 708 parts In-Stock

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Semicontronic

India . 1,130 parts In-Stock

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$30.070

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Aztec Data Supply Inc.

USA . 4,934 parts In-Stock

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A-Z Elektronik GmbH

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Lixinc

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S.R.D Solutions

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Bastille Electronics

Australia . 1,620 parts In-Stock

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Continental Prestige Electronics

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Advanced Electronics

New Zealand . 677 parts In-Stock

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Kepictronics

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Argo Parts USA

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ChipstoGo Electronic ltd

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Overview

Unlock seamless communication with the SC16IS752IPW by NXP Semiconductors, a leading manufacturer in the industry. This serial communication controller offers unparalleled reliability and efficiency, making it the go-to choice for various applications. From industrial automation to IoT devices, this product guarantees smooth data transfer at a blazing speed of 0.625 MBps. With its low power mode and wide operating temperature range, the SC16IS752IPW is a valuable asset that brings unmatched performance and convenience to your projects. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to damage, ensuring the long-term reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing flexibility in application design.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement and alignment on the circuit board, improving the overall assembly process.

Maximum Data Transfer Rate: 0.625 MBps

The high data transfer rate enables fast and efficient communication, making the product suitable for applications requiring quick data exchange.

Maximum Clock Frequency: 80 MHz

The high clock frequency allows for rapid processing of data, enhancing the performance of the product in demanding applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The serial communication controller functionality enables the product to efficiently manage serial communication tasks, enhancing its utility in various applications.

Technical Specifications

Serial Communication Controllers SC16IS752IPW attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

2

No. of Terminals:

28

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SC16IS752IPW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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