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UJA1075ATW/5V0,118

NXP Semiconductors

UJA1075ATW/5V0,118 by NXP Semiconductors

UJA1075ATW/5V0,118 by NXP Semiconductors is a CAN transceiver designed for automotive applications. It operates b/w -40 °C to 125 °C with a nominal voltage of 14V and supports data rates up to 1 Mbps. This compact device features a small outline package with 32 terminals for efficient integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

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Vyrian

USA . 6,048 parts In-Stock

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Anansix

USA . 2,172 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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Digiode

USA . 1,218 parts In-Stock

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Microchip USA

USA . 2,890 parts In-Stock

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$2.958

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AZTECH Wire

Italy . 615 parts In-Stock

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$21.440

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A-Z Elektronik GmbH

Germany . 5,723 parts In-Stock

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UNI Independent Distributors

Spain . 5,447 parts In-Stock

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Corphita

USA . 2,475 parts In-Stock

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Overview

Elevate your automotive projects with the UJA1075ATW/5V0,118 from NXP Semiconductors. Renowned for its cutting-edge innovation and reliability, NXP delivers a high-performance CAN transceiver designed to thrive in harsh conditions, ensuring robust communication across your network interfaces. With exceptional temperature resilience and compact design, this component not only enhances efficiency but also guarantees seamless integration into various applications, empowering you to drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides robust durability, making this network interface suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and reduced footprint on PCB, enhancing space efficiency.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and performance in automotive applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes PCB layout and component placement, facilitating easier assembly.

Power Supplies (V): 4.5/28

Wide operating voltage range (4.5V to 28V) provides flexibility for various applications and power supply configurations.

No. of Terminals: 32

A higher number of terminals enhances connectivity options and integration capabilities with other components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The small outline with heat sink capabilities ensures efficient heat dissipation, promoting thermal management in compact spaces.

Maximum Operating Temperature: 125 °C

High maximum operating temperature expands the range of environments this product can function in, particularly in automotive settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows reliable performance in extreme cold conditions, ideal for automotive applications.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal position provides versatile layout options for PCB design, improving design flexibility.

Maximum Seated Height: 1.1 mm

Low seated height contributes to a compact design, allowing for better integration into space-constrained applications.

Width: 6.1 mm

Compact width enables efficient layout on PCB, making it suited for densely populated boards.

Peak Reflow Temperature °C: 260

High peak reflow temperature indicates compatibility with standard soldering processes, ensuring reliable assembly.

Length: 11 mm

Short length assists in minimizing board space usage, enhancing overall product design efficiency.

Temperature Grade: AUTOMOTIVE

Designed for automotive grade applications, ensuring reliability and compliance with stringent industry standards.

Terminal Form: GULL WING

Gull wing terminals allow for more effective soldering and are preferred for surface mount applications, enhancing reliability.

Maximum Supply Current: 0.000098 mA

Extremely low supply current helps in energy efficiency, making it suitable for battery-powered applications.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, it supports robust communication protocols, crucial for automotive and industrial networks.

Nominal Supply Voltage: 14 V

Nominal supply voltage at 14V aligns well with automotive electrical systems, ensuring compatibility and performance.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch supports dense packing of components, which is ideal for modern compact electronic designs.

Data Rate: 1 Mbps

The 1 Mbps data rate enables efficient and fast data transfer, essential for real-time communications in network applications.

Technical Specifications

Network Interfaces UJA1075ATW/5V0,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000098 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1075ATW/5V0,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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