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UBA20271T/N1

NXP Semiconductors

UBA20271T/N1 by NXP Semiconductors

UBA20271T/N1 from NXP Semiconductors is a versatile power management IC designed for industrial applications. It operates at a nominal voltage of 13V, with a temperature range of -40 °C to 85 °C. This compact, surface-mount device features 20 terminals and adjustable thresholds for enhanced performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,829 parts In-Stock

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3,829

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Vyrian

USA . 2,557 parts In-Stock

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2,557

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Anansix

USA . 1,890 parts In-Stock

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1,890

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,358 parts In-Stock

1+ parts

$7.500

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1,358

$7.500

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Corphita

USA . 305 parts In-Stock

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305

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UNI Independent Distributors

Spain . 65 parts In-Stock

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Overview

Unlock unparalleled power management with the UBA20271T/N1 by NXP Semiconductors—your go-to solution for reliable energy efficiency. Designed with industrial-grade excellence, this robust IC ensures optimal performance in a variety of applications, from smart lighting to consumer electronics. Count on NXP’s legacy of innovation to deliver quality and reliability, transforming your designs into efficient power solutions that maximize value and enhance user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the IC's reliability, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy integration into modern circuit designs, saving space and simplifying manufacturing.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout options on circuit boards, facilitating efficient utilization of space.

Nominal Supply Voltage (Vsup): 13 V

A nominal supply voltage of 13 V makes the IC versatile for various power management applications, including high-voltage scenarios.

No. of Terminals: 20

With 20 terminals, this IC offers multiple connectivity options, allowing for complex circuit designs and improved functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact design, making it ideal for space-constrained applications in power management.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures that this IC can function reliably in a wide range of environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating effectively at -40 °C allows the IC to be used in extreme conditions, adding to its versatility for industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal position enhances board layout flexibility, improving circuit design options for engineers.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a compact design, allowing for multi-layer stacking in densely packed systems.

Width: 7.5 mm

The narrow width helps save PCB real estate, enabling more efficient designs especially in compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC supports power supply management, making it crucial for reliable operation in power-sensitive applications.

Length: 12.8 mm

A moderate length ensures compatibility with a variety of circuit designs, while still remaining compact.

Temperature Grade: INDUSTRIAL

Being rated for industrial applications indicates robustness and long-term reliability in challenging environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easier soldering and better mechanical strength, leading to more reliable installations.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for good signal integrity and simplifies the design of the PCB layout.

Adjustable Threshold: YES

The adjustable threshold feature provides flexibility in application settings, enabling customization to meet specific design requirements.

Technical Specifications

Power Management ICs UBA20271T/N1 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

UBA20271T/N1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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