Loading...

UBA20261T/N1

NXP Semiconductors

UBA20261T/N1 by NXP Semiconductors

UBA20261T/N1 from NXP Semiconductors is a versatile power management IC designed for industrial applications. It operates at a nominal voltage of 13V, with a temperature range of -40 °C to 85 °C. This compact device features 20 terminals and adjustable thresholds for enhanced performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

-

-

-

-

Digiode

USA . 776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

776

-

-

-

-

Vyrian

USA . 347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

347

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,556 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,556

$4.500

-

-

-

UNI Independent Distributors

Spain . 3,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,404

-

-

-

-

Corphita

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

-

-

-

-

Overview

Unlock superior power management with the UBA20261T/N1 from NXP Semiconductors, a leader in innovative semiconductor solutions. This robust IC guarantees reliability across diverse temperatures, making it ideal for industrial applications. Its compact design and surface mount capability streamline integration while enhancing performance. Choose NXP for unmatched quality and experience the benefits of efficient energy usage, ensuring your projects thrive under any conditions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various operating environments.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on PCBs, facilitating better layout options.

Nominal Supply Voltage (Vsup): 13 V

A nominal supply voltage of 13 V makes this IC versatile for a wide range of power supply applications.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for various functions and input/output requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for designs where space is at a premium while maintaining performance.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures the IC can function in moderately high temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for industrial and outdoor applications.

Terminal Position: DUAL

DUAL terminal position enhances the ease of mounting in various orientations, improving design flexibility.

Maximum Seated Height: 2.65 mm

A low seated height allows for low-profile designs, making it suitable for compact electronic devices.

Width: 7.5 mm

A width of 7.5 mm helps maximize functionality in tight spaces without compromising on performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC offers key functionalities like voltage regulation and monitoring.

Length: 12.8 mm

The 12.8 mm length contributes to an efficient footprint on PCBs, optimizing layout options for designers.

Temperature Grade: INDUSTRIAL

Being rated for industrial-grade temperatures ensures reliability in tough environments and applications.

Terminal Form: GULL WING

The gull wing terminal form provides robust electrical connections and reliable soldering during assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of handling during assembly.

Adjustable Threshold: YES

Adjustable threshold capability allows for customizable settings according to specific application requirements.

Technical Specifications

Power Management ICs UBA20261T/N1 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

UBA20261T/N1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12