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UBA20270T/N1

NXP Semiconductors

UBA20270T/N1 by NXP Semiconductors

UBA20270T/N1 from NXP Semiconductors is a versatile power management IC designed for industrial applications. It operates at a nominal voltage of 13V, with a temperature range of -40 °C to 85 °C. This compact device features 16 terminals in a small outline package, ensuring efficient performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,575 parts In-Stock

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4,575

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Digiode

USA . 4,308 parts In-Stock

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4,308

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Anansix

USA . 2,685 parts In-Stock

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2,685

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Distributors (Availability)

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One Stop Electronics

USA . 333 parts In-Stock

1+ parts

$6.500

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333

$6.500

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UNI Independent Distributors

Spain . 6,453 parts In-Stock

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6,453

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,092 parts In-Stock

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4,092

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Kepictronics

USA . 1,531 parts In-Stock

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1,531

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Overview

Elevate your power management solutions with the UBA20270T/N1 from NXP Semiconductors, a leader in innovation and quality. This versatile IC is designed for industrial applications, ensuring reliable performance even in extreme conditions. With its compact size and surface mount capability, it seamlessly integrates into your designs, offering enhanced efficiency and adaptability. Trust in NXP's legacy of excellence and unlock the potential of your projects with unparalleled reliability and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures resilience and protection against environmental factors, making this IC suitable for robust applications.

Surface Mount: YES

The surface mount capability facilitates compact design and easier integration into modern circuit boards, saving space in compact applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and optimized space usage, contributing to enhanced performance in electronic designs.

Nominal Supply Voltage (Vsup): 13 V

A nominal supply voltage of 13 V indicates versatility, allowing the IC to operate in a variety of power management applications with adequate voltage headroom.

No. of Terminals: 16

With 16 terminals, this product provides ample connection options, facilitating complex functionalities and enhanced circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is well-suited for high-density applications, fitting easily into tight spaces without compromising performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in industrial settings, making this IC capable of performing well under demanding conditions.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C expands the range of applications into extreme environments, essential for industrial and automotive uses.

Terminal Position: DUAL

Dual terminal position allows for flexible routing on the PCB, thus enhancing design versatility and simplifying the layout process.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm aids in compact designs, maintaining a profile that’s suitable for thin applications without jeopardizing performance.

Width: 3.9 mm

With a narrow width of 3.9 mm, this IC allows for greater design flexibility, fitting into compact spaces while providing essential power management functions.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC serves critical roles in power distribution, voltage regulation, and load management, vital for system stability.

Length: 9.9 mm

A length of 9.9 mm provides a balance between compactness and functionality, making it suitable for various applications without sacrificing performance.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this product ensures durability and reliability in harsh environments, suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent soldering characteristics, enhancing the reliability and robustness of the connection to the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for precise and efficient placement on PCBs, making it easier to integrate into various circuit layouts.

Adjustable Threshold: YES

The presence of an adjustable threshold feature enables customization for specific application requirements, offering flexibility and control in power management.

Technical Specifications

Power Management ICs UBA20270T/N1 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

UBA20270T/N1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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