Loading...

UBA20260T/N1

NXP Semiconductors

UBA20260T/N1 by NXP Semiconductors

UBA20260T/N1 from NXP Semiconductors is a robust power management IC designed for industrial applications. It operates at a nominal voltage of 13V, with a temperature range of -40 °C to 85 °C. This compact device features 16 terminals and adjustable thresholds for versatile use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

-

-

-

-

Anansix

USA . 1,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,530

-

-

-

-

Vyrian

USA . 448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

448

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 552 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$1.500

-

-

-

UNI Independent Distributors

Spain . 3,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,478

-

-

-

-

Corphita

USA . 2,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,688

-

-

-

-

Overview

Elevate your power management solutions with the UBA20260T/N1 from NXP Semiconductors, a trusted leader in innovation. Renowned for their exceptional quality and reliability, NXP delivers this versatile IC designed to enhance performance across diverse industrial applications. With its robust temperature range and compact design, it ensures efficient energy use and adaptability, empowering customers to optimize their systems while achieving lower operational costs. Experience unmatched value and seamless integration today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances the product's reliability and robustness, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mount compatible allows for space-saving on PCBs and simplifies the assembly process, which is ideal for high-density designs.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint, facilitating efficient layout and routing on circuit boards.

Nominal Supply Voltage (Vsup): 13 V

With a nominal supply voltage of 13 V, this IC is well-suited for applications requiring stable power without the need for excessive voltage regulation.

No. of Terminals: 16

Having 16 terminals allows for ample connectivity options, enabling complex circuit designs with multiple functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a reduced PCB area, making it perfect for space-constrained designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in high-heat environments typically found in industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this product suitable for harsh environments, ensuring reliability in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning facilitates better heat dissipation and enhances the reliability of the connection to the circuit.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm helps ensure compatibility with low-profile designs and contributes to overall compactness.

Width: 3.9 mm

The width of 3.9 mm allows for effective use of space without compromising on the functionality of the IC.

Length: 9.9 mm

At a length of 9.9 mm, this IC strikes a balance between compact design and sufficient terminal isolation for reliability.

Temperature Grade: INDUSTRIAL

Being classified under industrial temperature grade indicates its robustness and ability to perform reliably in demanding environments.

Terminal Form: GULL WING

Gull wing terminals enhance soldering ease and reliability, making it a preferred choice for automated assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a compact design while providing enough space for reliable solder connections.

Adjustable Threshold: YES

The adjustable threshold feature allows for customizable performance settings, providing flexibility in various applications.

Technical Specifications

Power Management ICs UBA20260T/N1 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

UBA20260T/N1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12