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TJA1050T/N,112

NXP Semiconductors

TJA1050T/N,112 by NXP Semiconductors

NXP Semiconductors' TJA1050T/N,112 is an 8-terminal network interface IC with a supply voltage of 5V. Operating in automotive-grade temperatures (-40 to 125°C), it features a Gull Wing terminal form and is surface-mountable. Ideal for interface circuits in automotive applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,339 parts In-Stock

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Digiode

USA . 2,569 parts In-Stock

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Anansix

USA . 536 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Microchip USA

USA . 438 parts In-Stock

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$6.221

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AZTECH Wire

Italy . 534 parts In-Stock

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$16.406

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Component Stockers USA

USA . 514 parts In-Stock

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$99.990

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One Stop Electronics

USA . 404 parts In-Stock

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$266.000

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404

$266.000

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Ampacity Inc.

Singapore . 566 parts In-Stock

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$724.000

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UNI Independent Distributors

Spain . 7,759 parts In-Stock

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Continental Prestige Electronics

USA . 5,382 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

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Overview

Unleash the power of seamless networking with the TJA1050T/N,112 by NXP Semiconductors. Crafted with precision and expertise, this Network Interface device promises top-notch quality and reliability. Perfect for automotive applications, this product offers unmatched value and efficiency. Experience smooth connectivity and enhanced performance like never before. Upgrade your networking capabilities today with the TJA1050T/N,112.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, making the product versatile and suitable for diverse networking needs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand demanding conditions and ensure reliable performance in various environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, ensuring secure connections and optimal signal transmission.

Width: 3.9 mm

The compact width of 3.9 mm allows for space-efficient integration into electronic devices and systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product meets industry standards for temperature tolerance and reliability in automotive environments.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, the product is compatible with standard power sources, making it easy to integrate into existing setups.

Technical Specifications

Network Interfaces TJA1050T/N,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1050T/N,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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