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TDF8599BTH/N1/S6,5

NXP Semiconductors

TDF8599BTH/N1/S6,5 by NXP Semiconductors

TDF8599BTH/N1/S6,5 by NXP Semiconductors is a dual audio amplifier designed for industrial applications. It operates at 14.4V with a max current of 120mA and withstands temperatures from -40 °C to 85 °C. Its compact surface mount design ensures efficient integration in various audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,174 parts In-Stock

1+ parts

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3,174

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Digiode

USA . 2,512 parts In-Stock

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2,512

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Anansix

USA . 2,369 parts In-Stock

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2,369

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 242 parts In-Stock

1+ parts

$2.889

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242

$2.889

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One Stop Electronics

USA . 324 parts In-Stock

1+ parts

$4.800

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324

$4.800

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AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$15.930

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202

$15.930

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Corphita

USA . 4,922 parts In-Stock

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4,922

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UNI Independent Distributors

Spain . 1,974 parts In-Stock

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1,974

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Overview

Experience unparalleled audio quality with the TDF8599BTH/N1/S6,5 from NXP Semiconductors! This advanced audio amplifier offers exceptional performance in a compact design, making it perfect for applications ranging from consumer electronics to industrial systems. With NXP's commitment to innovation and reliability, elevate your sound experience while enjoying energy efficiency and robust temperature performance. Choose TDF8599BTH for crystal-clear audio that resonates!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy reduces weight and enhances durability, making this amplifier suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit designs and saves space on PCBs.

No. of Functions: 2

With two functions, this amplifier offers versatility and the ability to simplify designs by combining functionalities.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient space utilization in compact designs, fitting easily into various applications.

General IC Type: AUDIO AMPLIFIER

Designed specifically as an audio amplifier, it ensures high-quality sound performance for audio applications.

Power Supplies (V): 14.4

A power supply range of 14.4V allows for effective performance in a variety of audio systems, providing the necessary power for operations.

No. of Terminals: 36

The 36 terminals provide ample connection points for flexibility in design and ease of integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with shrink pitch enables more compact designs, which is essential in today's miniaturized electronics.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this amplifier is suitable for use in environments that experience higher temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliability in extreme environments, making this amplifier versatile.

Terminal Position: DUAL

Dual terminal positioning provides ease of connection and improves layout flexibility in circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperatures, this amplifier is reliable and suitable for a wide range of demanding applications.

Technology: BCDMOS

BCD technology enhances efficiency and performance, catering to modern audio amplifier requirements.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capabilities, ensuring secure and reliable connections in various applications.

Maximum Supply Current: 120 mA

A maximum supply current of 120 mA indicates sufficient power handling for efficient audio amplification.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for tighter layouts while maintaining a robust connection, ideal for circuit density.

Technical Specifications

Audio & Video Amplifiers TDF8599BTH/N1/S6,5 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Functions:

2

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

120 mA

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDF8599BTH/N1/S6,5 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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