Loading...

TDF8546TH/N1,518

NXP Semiconductors

TDF8546TH/N1,518 by NXP Semiconductors

TDF8546TH/N1,518 by NXP Semiconductors is a versatile audio amplifier featuring 4 functions and operates within -40 °C to 105 °C. It supports a supply voltage of 14.4V and has a max current of 350mA. Ideal for industrial applications, it comes in a compact surface mount package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,134

-

-

-

-

Digiode

USA . 1,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,360

-

-

-

-

Anansix

USA . 165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

165

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,449 parts In-Stock

1+ parts

$2.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,449

$2.800

-

-

-

Microchip USA

USA . 474 parts In-Stock

1+ parts

$14.070

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$14.070

-

-

-

AZTECH Wire

Italy . 401 parts In-Stock

1+ parts

$17.470

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$17.470

-

-

-

Ampacity Inc.

Singapore . 1,531 parts In-Stock

1+ parts

$21.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

$21.800

-

-

-

Component Stockers USA

USA . 466 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

466

$99.990

-

-

-

UNI Independent Distributors

Spain . 6,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,532

-

-

-

-

Corphita

USA . 749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

749

-

-

-

-

Overview

Elevate your audio experience with NXP Semiconductors' TDF8546TH/N1,518 amplifier. Designed for reliability and exceptional performance, this high-quality audio amplifier seamlessly enhances sound in a variety of applications, from automotive to home entertainment. With its compact design, robust temperature range, and efficient power management, it delivers superior audio fidelity while ensuring longevity. Trust NXP's innovation to transform your audio solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and ensures resistance to environmental factors, making the amplifier suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact designs, saving PCB space and simplifying manufacturing.

No. of Functions: 4

With four functions, this amplifier provides versatility, supporting various audio applications in a single package.

Package Shape: RECTANGULAR

The rectangular shape is optimal for PCB layout efficiency, allowing for better arrangement of components.

General IC Type: AUDIO AMPLIFIER

Designed specifically as an audio amplifier, it is tailored for high-quality sound performance, making it ideal for audio applications.

Power Supplies (V): 14.4

Operating at a power supply of 14.4V provides sufficient headroom for driving various audio loads while maintaining performance.

No. of Terminals: 36

The 36 terminals offer enhanced connectivity options, providing flexibility for designing different audio circuit configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with shrink pitch minimizes footprint while allowing for high component density, ideal for modern electronic designs.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, this amplifier can function reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 °C ensures the amplifier can perform in extreme conditions, suitable for industrial applications.

Terminal Position: DUAL

Dual terminal positions improve accessibility and layout flexibility during PCB assembly, reducing design complexity.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this amplifier meets stringent reliability and performance standards for demanding applications.

Technology: BCDMOS

The BCDMOS technology enhances performance and power efficiency, making this amplifier suitable for high-performance audio applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and reliability, ensuring a strong connection on PCBs.

Maximum Supply Current: 350 mA

A maximum supply current of 350 mA allows for robust performance in demanding audio situations while maintaining efficiency.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch is ideal for high-density PCB layouts, promoting efficient use of space and enabling enhanced circuit design.

Technical Specifications

Audio & Video Amplifiers TDF8546TH/N1,518 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDF8546TH/N1,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20