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TDF8530TH/N1,512

NXP Semiconductors

TDF8530TH/N1,512 by NXP Semiconductors

TDF8530TH/N1,512 from NXP Semiconductors is a versatile audio amplifier designed for industrial applications. It operates within -40 °C to 85 °C and supports up to 200 mA supply current. With 4 functions in a compact SOIC package, it ensures reliable performance in automotive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,155 parts In-Stock

1+ parts

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5,155

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Digiode

USA . 3,458 parts In-Stock

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3,458

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Anansix

USA . 2,451 parts In-Stock

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2,451

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$3.603

100+ parts

$3.279

1k+ parts

$2.954

10k+ parts

-

500

$3.603

$3.279

$2.954

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AZTECH Wire

Italy . 1,114 parts In-Stock

1+ parts

$11.060

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1,114

$11.060

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One Stop Electronics

USA . 1,031 parts In-Stock

1+ parts

$18.800

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1,031

$18.800

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QUARKTWIN TECHNOLOGY LTD

USA . 14,022 parts In-Stock

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14,022

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Microchip USA

USA . 5,216 parts In-Stock

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5,216

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UNI Independent Distributors

Spain . 5,086 parts In-Stock

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5,086

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Corphita

USA . 517 parts In-Stock

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517

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Overview

Elevate your audio experience with the TDF8530TH/N1,512 from NXP Semiconductors—a trusted leader in innovation. This versatile audio amplifier excels in automotive and industrial applications, delivering superior sound quality while ensuring reliability across extreme conditions. Engineered for performance, it promises efficiency and durability, giving you peace of mind. Choose TDF8530TH/N1,512 for unmatched audio clarity and a competitive edge in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and ensures long-term reliability in various environments.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, saving space and improving manufacturing efficiency.

No. of Functions: 4

With four functions, this amplifier offers versatility for multiple applications, making it suitable for a range of audio needs.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates high quality and reliability, essential for automotive and industrial applications.

Package Shape: RECTANGULAR

The rectangular shape is optimized for layout and space-saving in circuit designs, enhancing overall performance.

General IC Type: AUDIO AMPLIFIER

Designed specifically as an audio amplifier, it ensures high-quality sound output for audio applications.

Power Supplies (V): 14.4

With a power supply requirement of 14.4V, this amplifier is suitable for automotive and high-power applications.

No. of Terminals: 44

A high number of terminals allows for enhanced connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline design with shrink pitch provides a compact footprint, conducive for tight spaces in modern electronic devices.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures that this product can handle high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this amplifier suitable for harsh environments and outdoor applications.

Terminal Position: DUAL

Dual terminal position facilitates diverse layout possibilities on PCB, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures performance consistency across various environmental conditions.

Technology: BCDMOS

BCD technology offers improved performance efficiency, reduced power consumption, and enhanced thermal management.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering for robust mechanical and electrical connections.

Maximum Supply Current: 200 mA

A maximum supply current of 200 mA indicates sufficient power capacity for driving audio applications effectively.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for modern, compact PCBs, ensuring compatibility with various designs.

Technical Specifications

Audio & Video Amplifiers TDF8530TH/N1,512 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

No. of Functions:

4

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.55

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

200 mA

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDF8530TH/N1,512 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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