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SPC5746CSK1AMMH6

NXP Semiconductors

SPC5746CSK1AMMH6 by NXP Semiconductors

NXP Semiconductors' SPC5746CSK1AMMH6 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 393216 bytes of RAM. Ideal for automotive applications requiring ISO 26262 screening, it offers 31-Ch 12-Bit ADC channels and low power mode for efficient performance.

Median Price

$17.820

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,413 parts In-Stock

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-

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$17.820

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$15.950

10k+ parts

$15.010

2,413

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$17.820

$15.950

$15.010

Distributors (In-Stock)

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Digiode

USA . 2,077 parts In-Stock

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$18.820

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2,077

$18.820

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Vyrian

USA . 2,221 parts In-Stock

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Anansix

USA . 1,634 parts In-Stock

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Flip Electronics

USA . 880 parts In-Stock

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Netsource Technology, Inc.

USA . 505 parts In-Stock

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505

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Nova Conductors

Japan . 450 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 915 parts In-Stock

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$11.320

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Ampacity Inc.

Singapore . 1,943 parts In-Stock

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$16.840

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Corphita

USA . 2,480 parts In-Stock

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$17.829

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$17.829

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Vigor

Singapore . 1,515 parts In-Stock

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$38.060

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Corohmni

South Africa . 128 parts In-Stock

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$39.368

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Microchip USA

USA . 1,874 parts In-Stock

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$50.135

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A-Z Elektronik GmbH

Germany . 6,803 parts In-Stock

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Argo Parts USA

USA . 5,159 parts In-Stock

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Continental Prestige Electronics

USA . 2,889 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Aranea Global

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UNI Independent Distributors

Spain . 483 parts In-Stock

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Kepictronics

USA . 106 parts In-Stock

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Overview

Discover the cutting-edge SPC5746CSK1AMMH6 microcontroller by NXP Semiconductors, setting new standards in quality and performance. Designed for a wide range of applications, this innovative device offers integrated cache, advanced ADC channels, and low power modes for optimized efficiency. With NXP's proven expertise in semiconductor technology, customers can trust in the reliability and durability of this product. Unlock the potential of your projects with the SPC5746CSK1AMMH6 microcontroller, delivering unmatched value and benefits to drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness, making the product reliable and affordable.

Integrated Cache: YES

Having integrated cache helps in faster data access and processing, improving the overall performance of the microcontroller.

Maximum Supply Voltage: 1.32 V

This voltage level provides optimal power supply for the microcontroller to operate efficiently without the risk of overloading.

RAM Bytes: 393216

With a large RAM size, the microcontroller can handle complex programs and data storage effectively, enhancing its capabilities for various applications.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for faster processing of instructions, making the microcontroller suitable for tasks that require quick response times.

Connectivity: DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4)

The multiple connectivity options make it versatile and compatible with different communication protocols, enabling seamless integration with other devices.

Technical Specifications

Microcontrollers SPC5746CSK1AMMH6 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e2

Length:

11 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of I/O Lines:

65

No. of Terminals:

100

No. of Timers:

64

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.41 mm

Speed:

160 rpm

Maximum Supply Current:

264 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

131072

Connectivity:

DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT

Analog To Digital Convertors:

31-Ch 12-Bit, 68-Ch 10-Bit

Trade Compliance

SPC5746CSK1AMMH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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