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SPC5634MF1MMG80

NXP Semiconductors

SPC5634MF1MMG80 by NXP Semiconductors

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Tin/Silver (Sn/Ag);

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,318 parts In-Stock

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6,318

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Anansix

USA . 2,315 parts In-Stock

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2,315

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Digiode

USA . 97 parts In-Stock

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97

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Distributors (Availability)

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One Stop Electronics

USA . 1,013 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 413 parts In-Stock

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$13.420

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413

$13.420

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Vigor

Singapore . 3,167 parts In-Stock

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$31.598

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3,167

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Microchip USA

USA . 1,485 parts In-Stock

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$50.910

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1,485

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UNI Independent Distributors

Spain . 3,442 parts In-Stock

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3,442

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Corphita

USA . 152 parts In-Stock

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Technical Specifications

Microcontrollers SPC5634MF1MMG80 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

Tin/Silver (Sn/Ag)

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

SPC5634MF1MMG80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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