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SCN26562C2A52

NXP Semiconductors

SCN26562C2A52 by NXP Semiconductors

SCN26562C2A52 by NXP Semiconductors is a versatile serial communication controller with a max data rate of 0.3125 MBps, supporting various protocols like ASYNC and HDLC. It operates b/w 4.75V-5.25V and features a compact 52-terminal chip carrier design. Ideal for applications requiring reliable data transfer in commercial environments, it withstands temperatures up to 70 °C.

Median Price

$36.670

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 413 parts In-Stock

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Digiode

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Vyrian

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Anansix

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J2 Sourcing AB

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Q Components

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One Stop Electronics

USA . 1,540 parts In-Stock

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Corohmni

South Africa . 62 parts In-Stock

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Corphita

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UNI Independent Distributors

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Kepictronics

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Overview

Unlock seamless communication for your projects with the SCN26562C2A52 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP empowers your designs with a versatile serial communication controller that excels in numerous applications. Benefit from reliable data transfer rates and robust performance, ensuring your devices stay connected efficiently. Choose NXP for unparalleled support and reliability that drives success in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for smaller, more compact designs, making it suitable for modern electronics.

Maximum Supply Voltage: 5.25 V

Supports a wide voltage range, offering flexibility for various applications.

Address Bus Width: 6

A wider address bus allows for enhanced data processing capabilities, improving performance.

Package Shape: SQUARE

The square shape optimizes space utilization on PCB layouts, fitting better in dense configurations.

No. of Terminals: 52

A higher number of terminals facilitates multiple connections and greater functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier style enhances thermal performance and mounting stability in circuit boards.

Minimum Supply Voltage: 4.75 V

Offers low-voltage operation, making it energy-efficient and compatible with various power supplies.

Maximum Operating Temperature: 70 °C

High operating temperature capability ensures reliability in demanding environments.

Maximum Data Transfer Rate: 0.3125 MBps

Decent data transfer rate is suitable for many serial communication applications requiring efficiency.

Minimum Operating Temperature: 0 °C

Can operate in cold environments, adding versatility to application scenarios.

Terminal Position: QUAD

Quad terminal position allows for easier routing and connection to other components on the board.

Maximum Seated Height: 4.57 mm

Compact design saves PCB space and allows for denser component placement.

Width: 19.1262 mm

Standard width fits common PCB layouts while providing necessary functionality.

Data Encoding or Decoding Method: NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)

Supports various encoding methods, enhancing compatibility with different communication standards.

External Data Bus Width: 8

An 8-bit external data bus offers efficient data handling, optimizing performance.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP

Supports multiple communication protocols, ensuring adaptability for diverse interfacing needs.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for quick processing and improved communication speed.

Length: 19.1262 mm

Standard length facilitates easy design integration into existing hardware.

Temperature Grade: COMMERCIAL

Commercial grade temperature ratings make it suitable for a wide range of applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

Multi-protocol capability ensures flexibility and versatility in application designs.

Technology: NMOS

NMOS technology generally provides high-speed performance and low power consumption.

Terminal Form: J BEND

J-bend terminals allow for stable and secure mounting on the PCB.

Maximum Supply Current: 275 mA

Moderate maximum supply current contributes to overall energy efficiency and lower heat generation.

Nominal Supply Voltage: 5 V

Standard nominal voltage matches common power supplies, simplifying compatibility.

No. of DMA Channels: 2

Having two DMA channels enhances data transfer capabilities, improving system performance.

No. of Serial I/Os: 2

Dual serial I/O ports provide flexibility for simultaneous communication tasks.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easier soldering and compatibility with various mounting systems.

Technical Specifications

Serial Communication Controllers SCN26562C2A52 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

6

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP

Data Encoding or Decoding Method:

NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

.3125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J52

Length:

19.1262 mm

Low Power Mode:

NO

No. of DMA Channels:

2

No. of I/O Lines:

0

No. of Serial I/Os:

2

No. of Terminals:

52

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

275 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.1262 mm

Trade Compliance

SCN26562C2A52 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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