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SC28L198A1BE,551

NXP Semiconductors

SC28L198A1BE,551 by NXP Semiconductors

SC28L198A1BE,551 by NXP Semiconductors is a Serial Communication Controller with 8-bit address bus width and 8 MHz clock frequency. It operates at a voltage range of 4.5V to 5.5V, suitable for industrial applications requiring low power mode and high data transfer rate of 0.061 MBps.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,751 parts In-Stock

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Digiode

USA . 2,732 parts In-Stock

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Anansix

USA . 319 parts In-Stock

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319

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 672 parts In-Stock

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$18.394

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One Stop Electronics

USA . 666 parts In-Stock

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$20.000

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Ampacity Inc.

Singapore . 552 parts In-Stock

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$22.000

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Microchip USA

USA . 4,813 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,655 parts In-Stock

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Bastille Electronics

Australia . 2,702 parts In-Stock

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Corphita

USA . 2,187 parts In-Stock

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UNI Independent Distributors

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Overview

Enhance your communication systems with the SC28L198A1BE,551 from NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This Serial Communication Controller offers seamless integration for a wide range of applications, providing unparalleled value and benefits to customers. Say goodbye to communication challenges and experience the advantages of this innovative product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, allowing for easy handling and protection of internal components.

Surface Mount: YES

Surface mount design facilitates easy and convenient PCB assembly, reducing overall production time and cost.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage tolerance ensures robust and stable operation in various power supply scenarios.

Address Bus Width: 8

8-bit address bus width provides ample memory addressing capabilities for efficient data transfer and storage.

Package Shape: SQUARE

Square shape package allows for efficient space utilization on the PCB, leading to a compact and streamlined design.

Power Supplies (V): 3.3

Operates efficiently at a moderate power supply voltage of 3.3V, conserving energy and reducing power consumption.

No. of Terminals: 100

Large number of terminals provide connectivity options for various external components, enhancing versatility and compatibility.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures reliable operation even in low power supply conditions, improving overall product reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance enables the product to function optimally in high-temperature environments, ensuring durability and performance.

Maximum Data Transfer Rate: 0.06103515625 MBps

High data transfer rate allows for fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance ensures reliable operation even in extreme cold conditions, making the product suitable for a wide range of environments.

Terminal Finish: Tin (Sn)

Tin terminal finish provides corrosion resistance and solderability, ensuring long-term reliability and connectivity.

Terminal Position: QUAD

Quad terminal position design simplifies PCB layout and improves signal integrity, enhancing overall product performance.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for a slim and compact design, saving space on the PCB and facilitating installation in constrained environments.

Width: 14 mm

Compact width dimension enables easy integration into various electronic devices, offering flexibility in product design and layout.

External Data Bus Width: 8

8-bit external data bus width supports efficient data transfer and processing, ensuring smooth and seamless communication between connected devices.

Communication Protocol: ASYNC, BIT

Support for asynchronous and bit-level communication protocols allows for flexible and versatile data transmission options for different applications.

Maximum Clock Frequency: 8 MHz

High maximum clock frequency enables fast data processing and communication, improving system efficiency and performance.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during the reflow process, ensuring proper connections and long-term product durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand the soldering process without damage, contributing to overall reliability.

Length: 14 mm

Compact length dimension enables space-saving design and easy integration into customized electronic systems, providing flexibility in product layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Peripheral IC type specifically designed for serial IO and communication control enables seamless data transfer and integration with various devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems, ensuring efficient operation and performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable electrical connections, ensuring stable operation and long-term durability.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with common power sources, simplifying integration and system design.

No. of Serial I/Os: 8

Multiple serial IO ports provide versatile connectivity options for external devices, expanding compatibility and functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and compact PCB layout, optimizing space utilization and design flexibility.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain product quality.

Low Power Mode: YES

Support for low power mode operation enables energy-efficient performance and extended battery life, ideal for portable and battery-powered devices.

Technical Specifications

Serial Communication Controllers SC28L198A1BE,551 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

8

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.06103515625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

8

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SC28L198A1BE,551 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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