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SC16C750BIB64,157

NXP Semiconductors

SC16C750BIB64,157 by NXP Semiconductors

SC16C750BIB64,157 by NXP Semiconductors is a Serial Communication Controller with 5.5V max supply voltage, 0.375 MBps data transfer rate, and 48 MHz clock frequency. It is used in industrial applications for asynchronous communication protocols and low power mode operation.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

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Anansix

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 648 parts In-Stock

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AZTECH Wire

Italy . 849 parts In-Stock

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One Stop Electronics

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Microchip USA

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Overview

Unlock seamless communication with the SC16C750BIB64,157 by NXP Semiconductors. Crafted with precision and quality, this Serial Communication Controller offers unparalleled reliability for a wide range of applications. Experience swift data transfer rates and efficient performance, making it the perfect choice for industrial-grade projects. Trust in NXP Semiconductors to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the SC16C750BIB64,157 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the serial communication controller.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Support for up to 5.5V supply voltage ensures compatibility with a wide range of power sources.

Address Bus Width: 3

A 3-bit address bus width allows for a larger memory address space, enabling more versatile communication capabilities.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment on the PCB, optimizing space utilization.

Power Supplies (V): 2.5/5

Support for multiple power supply options (2.5V and 5V) offers flexibility in powering the communication controller.

No. of Terminals: 64

64 terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch terminals enhances the overall compactness and efficiency of the communication controller.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5V ensures reliable operation even under varying power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C enables the controller to perform consistently in demanding industrial environments.

Maximum Data Transfer Rate: 0.375 MBps

High data transfer rate of 0.375 MBps ensures fast and efficient communication between connected devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature threshold of -40°C allows the controller to function reliably in extreme cold conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish provides corrosion resistance and ensures durable connections for long-term performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easy installation and maintenance of the communication controller on the PCB.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm contributes to the overall slim and compact profile of the communication controller.

Width: 10 mm

10mm width makes the controller easy to integrate into various PCB layouts while conserving space.

External Data Bus Width: 8

8-bit external data bus width enables high-speed data transfer and processing capabilities for efficient communication tasks.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol ensures flexible and reliable data exchange with external devices.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency of 48MHz allows for rapid data processing and accurate timing control in communication operations.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature of 260°C ensures proper soldering and connection reliability during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures secure and durable solder joints for the communication controller.

Length: 10 mm

Compact 10mm length allows for easy integration of the controller into tight PCB layouts while maintaining efficient functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating environments with varying temperature conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Dedicated peripheral IC type for serial I/O and communication tasks provides specialized functionality for efficient data exchange and control.

Technology: CMOS

CMOS technology delivers low power consumption and high performance for energy-efficient and reliable operation of the communication controller.

Terminal Form: GULL WING

Gull wing terminal form ensures secure attachment to the PCB for stable and reliable connections in communication applications.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage ensures consistent and reliable power delivery for optimal performance of the communication controller.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm allows for compact terminal placement on the PCB, optimizing space utilization and connectivity options.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation of the communication controller, reducing power consumption and enhancing overall efficiency.

Technical Specifications

Serial Communication Controllers SC16C750BIB64,157 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SC16C750BIB64,157 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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