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SC16C2550BIB48,128

NXP Semiconductors

SC16C2550BIB48,128 by NXP Semiconductors

SC16C2550BIB48,128 by NXP Semiconductors is a Serial Communication Controller with 3.63V max supply voltage, 0.625 MBps data transfer rate, and 80 MHz clock frequency. Ideal for industrial applications requiring high-speed asynchronous communication over serial interfaces.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 12,840 parts In-Stock

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Digiode

USA . 3,530 parts In-Stock

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Anansix

USA . 478 parts In-Stock

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Nova Conductors

Japan . 79 parts In-Stock

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One Stop Electronics

USA . 1,613 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 577 parts In-Stock

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Ampacity Inc.

Singapore . 1,084 parts In-Stock

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Microchip USA

USA . 456 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$33.519

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$30.502

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$27.486

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QUARKTWIN TECHNOLOGY LTD

USA . 6,597 parts In-Stock

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UNI Independent Distributors

Spain . 3,721 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 170 parts In-Stock

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Overview

Enhance your communication systems with the SC16C2550BIB48,128 by NXP Semiconductors. This top-quality Serial Communication Controller offers seamless data transfer at a maximum rate of 0.625 MBps, ensuring reliable performance in industrial settings. With a wide supply voltage range and low profile packaging, this versatile device is perfect for various applications requiring efficient serial communication. Trust NXP Semiconductors for cutting-edge technology that delivers unmatched value and benefits to customers looking for superior connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature makes installation and integration of this product easy and convenient, saving time and effort in the assembly process.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63 V, this product can safely operate within a wide range of voltage inputs, offering flexibility in power supply options.

Address Bus Width: 3

The 3 address bus width allows for efficient and precise communication within the system, contributing to reliable data transfer and processing.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it suitable for applications where size constraints are a consideration.

Power Supplies (V): 2.5/5

The dual power supply options of 2.5 V and 5 V provide versatility in power management, allowing compatibility with various voltage requirements in different applications.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options for interfacing with other components or devices, enhancing the versatility and functionality of the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers a compact and efficient design, facilitating high-density mounting and enabling space-saving configurations.

Minimum Supply Voltage: 2.97 V

The minimum supply voltage of 2.97 V ensures reliable and stable operation even under low voltage conditions, enhancing the product's performance in diverse operating environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures, making it suitable for industrial applications with demanding temperature requirements.

Technical Specifications

Serial Communication Controllers SC16C2550BIB48,128 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

SC16C2550BIB48,128 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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