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SAA7706H/N210S,557

NXP Semiconductors

SAA7706H/N210S,557 by NXP Semiconductors

NXP Semiconductors' SAA7706H/N210S,557 is a DSP with 80 terminals and operates at clock frequency of 0.4 MHz. It has a supply voltage range of 3-3.6 V and temperature grade suitable for industrial applications. The package style is flatpack, making it ideal for digital signal processing in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,497 parts In-Stock

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Anansix

USA . 361 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Digiode

USA . 54 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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One Stop Electronics

USA . 534 parts In-Stock

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AZTECH Wire

Italy . 359 parts In-Stock

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Microchip USA

USA . 257 parts In-Stock

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Ampacity Inc.

Singapore . 1,518 parts In-Stock

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Corohmni

South Africa . 111 parts In-Stock

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Component Stockers USA

USA . 472 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,392 parts In-Stock

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UNI Independent Distributors

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GreenTree Electronics

Israel . 4,950 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 797 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Experience unparalleled performance and efficiency with the SAA7706H/N210S,557 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This Digital Signal Processor (DSP) is perfect for a wide range of applications, offering incredible value and benefits to customers. Enhance your projects with this versatile and innovative product, designed to exceed your expectations. Upgrade your technology with NXP and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the DSP, making it suitable for a variety of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in powering the DSP and potentially extending its use in various applications.

Package Shape: RECTANGULAR

Rectangular shape makes the DSP easy to integrate into existing circuit designs and ensures efficient use of space on the PCB.

No. of Terminals: 80

Having a higher number of terminals provides greater connectivity options and flexibility for interfacing with external components.

Package Style (Meter): FLATPACK

Flatpack style offers a compact and low-profile package, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging thermal environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the DSP to operate effectively in cold conditions, expanding its range of applications.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, reducing the risk of signal interference or loss.

Maximum Seated Height: 3.2 mm

Low seated height enables the DSP to be easily accommodated within slim and compact designs.

Width: 14 mm

Compact width measurement ensures the DSP can fit into tight spaces and densely packed PCB layouts.

Maximum Clock Frequency: 0.4 MHz

High maximum clock frequency allows for fast and efficient signal processing, ideal for real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides enhanced data transfer capabilities and supports parallel processing tasks.

Length: 20 mm

Moderate length measurement offers a balance between compact size and necessary functionality for the DSP.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures durability and reliability for use in harsh operating environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed as a digital signal processor, offering specialized functionality and performance for signal processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, making the DSP efficient and effective for various applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and ease of assembly during PCB manufacturing.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance of the DSP across different operating conditions.

Terminal Pitch: 0.8 mm

Narrow terminal pitch provides high density and fine-pitch connections, making the DSP suitable for compact and space-efficient designs.

Format: FIXED POINT

Fixed-point format allows for efficient and fast arithmetic operations in signal processing tasks, providing high performance and accuracy.

Technical Specifications

Digital Signal Processors (DSPs) SAA7706H/N210S,557 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

.4 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G80

Length:

20 mm

Low Power Mode:

NO

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAA7706H/N210S,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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