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SAA7706H/N210,557

NXP Semiconductors

SAA7706H/N210,557 by NXP Semiconductors

NXP Semiconductors' SAA7706H/N210,557 is a DSP with 80 terminals and operates at clock frequency of 0.4 MHz. It has a supply voltage range of 3-3.6 V and temperature range of -40 to 85°C. Ideal for industrial applications requiring digital signal processing in compact form factor.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

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Anansix

USA . 2,485 parts In-Stock

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Digiode

USA . 92 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 1,464 parts In-Stock

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AZTECH Wire

Italy . 668 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 1,175 parts In-Stock

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Corohmni

South Africa . 65 parts In-Stock

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Bastille Electronics

Australia . 4,199 parts In-Stock

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Continental Prestige Electronics

USA . 2,575 parts In-Stock

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UNI Independent Distributors

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Corphita

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Argo Parts USA

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Overview

Discover the groundbreaking SAA7706H/N210,557 by NXP Semiconductors, a top-of-the-line Digital Signal Processor that offers unparalleled performance and reliability. With a focus on quality and innovation, NXP Semiconductors delivers cutting-edge technology in every product. This versatile DSP is ideal for a wide range of applications, providing customers with unmatched value and benefits. Experience the advantages of the SAA7706H/N210,557 and elevate your projects to new heights with this exceptional component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it a reliable choice for various environments.

Surface Mount: YES

Allows for easy and efficient installation, especially in compact spaces or on printed circuit boards.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle power fluctuations without risking damage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and organization within a system or device.

No. of Terminals: 80

With a high number of terminals, this DSP can accommodate complex connections and configurations.

Package Style (Meter): FLATPACK

The flatpack style offers a compact design, ideal for applications where space is limited.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with various power sources, enhancing versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can perform reliably in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without performance issues.

Terminal Finish: SILVER

The silver terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers stability and robustness in connectivity for consistent performance.

Maximum Seated Height: 3.2 mm

The low seated height allows for a compact overall design, suitable for space-constrained applications.

Width: 14 mm

The moderate width allows for easy integration into various systems or devices without taking up too much space.

Maximum Clock Frequency: 0.4 MHz

With a high maximum clock frequency, this DSP can process data quickly and efficiently.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer speeds and overall performance.

Length: 20 mm

The length of 20 mm strikes a balance between space-saving design and accommodating necessary components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific peripheral IC type indicates specialized functionality for advanced signal processing tasks.

Technology: CMOS

The CMOS technology offers low power consumption, making this DSP an energy-efficient choice.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability for secure connections.

Nominal Supply Voltage: 3.3 V

With a stable nominal supply voltage, this DSP operates consistently and reliably within specified parameters.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise and secure connections in tight spaces or high-density layouts.

Format: FIXED POINT

The fixed-point format offers efficient arithmetic operations, suitable for many signal processing applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of protection against moisture damage, ensuring longevity in various environmental conditions.

Technical Specifications

Digital Signal Processors (DSPs) SAA7706H/N210,557 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

.4 MHz

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G80

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAA7706H/N210,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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