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PSMN050-80PS,127

NXP Semiconductors

PSMN050-80PS,127 by NXP Semiconductors

PSMN050-80PS,127 by NXP Semiconductors is an N-channel enhancement mode FET ideal for power applications. It supports a max drain current of 22 A and power dissipation of 56 W, operating up to 175 °C. Perfect for efficient switching in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,999 parts In-Stock

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4,999

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Vyrian

USA . 3,893 parts In-Stock

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3,893

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Anansix

USA . 596 parts In-Stock

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AZTECH Wire

Italy . 775 parts In-Stock

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$12.640

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775

$12.640

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One Stop Electronics

USA . 790 parts In-Stock

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$13.050

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790

$13.050

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QUARKTWIN TECHNOLOGY LTD

USA . 21,100 parts In-Stock

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Corphita

USA . 4,044 parts In-Stock

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UNI Independent Distributors

Spain . 3,740 parts In-Stock

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Microchip USA

USA . 320 parts In-Stock

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Overview

Elevate your power management solutions with the PSMN050-80PS,127 from NXP Semiconductors. Renowned for their cutting-edge technology and reliability, NXP delivers superior performance with this N-channel FET, perfect for demanding applications in automotive, industrial, and consumer electronics. Experience unmatched efficiency and thermal robustness, ensuring your designs achieve optimal performance while reducing energy costs. Trust in NXP’s commitment to quality and innovation for all your power needs!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and better performance compared to P-channel FETs, making them ideal for high-efficiency applications.

Configuration: SINGLE

A single configuration simplifies the design and can help reduce the PCB space required in applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control of the current, enabling efficient switching and amplification capabilities in various circuits.

Maximum Drain Current (Abs) (ID): 22 A

The high maximum drain current allows this FET to handle demanding applications that require significant current flow without overheating.

Maximum Power Dissipation (Abs): 56 W

With a high power dissipation rating, this FET can manage heat effectively, enhancing reliability and performance under load.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, making it perfect for low-voltage and high-efficiency applications.

Maximum Operating Temperature: 175 °C

The ability to operate at higher temperatures ensures that this FET remains reliable in harsh environments, increasing its versatility.

Terminal Finish: Tin (Sn)

The tin finish provides good solderability and corrosion resistance, which is important for long-term performance in various applications.

Maximum Drain Current (ID): 22 A

This specification is repeated for emphasis, confirming the robustness of the FET to support high current loads efficiently.

Technical Specifications

Power Field Effect Transistors (FET) PSMN050-80PS,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Trade Compliance

PSMN050-80PS,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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