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PSMN012-25YLC,115

NXP Semiconductors

PSMN012-25YLC,115 by NXP Semiconductors

PSMN012-25YLC,115 by NXP Semiconductors is an N-channel power FET designed for high-efficiency applications. It supports a max drain current of 33 A and operates at temperatures up to 175 °C, making it ideal for demanding power management tasks. Its surface mount configuration ensures easy integration into compact designs.

Median Price

$0.454

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

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$0.454

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$0.377

10k+ parts

$0.336

160

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$0.454

$0.377

$0.336

Distributors (In-Stock)

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Digiode

USA . 2,312 parts In-Stock

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$0.155

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$0.155

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Vyrian

USA . 8,661 parts In-Stock

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Anansix

USA . 317 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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50

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Distributors (Availability)

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Corphita

USA . 1,258 parts In-Stock

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$0.147

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AZTECH Wire

Italy . 1,157 parts In-Stock

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$21.430

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UNI Independent Distributors

Spain . 7,609 parts In-Stock

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Perfect Parts

USA . 112 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Glotronic Ltd.

UK . 40 parts In-Stock

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Overview

Elevate your projects with the PSMN012-25YLC,115 from NXP Semiconductors, a leader in innovation and quality. This high-performance N-channel power FET offers exceptional efficiency and reliability, perfect for demanding applications like motor control and power management. With a robust design suited for surface mounting, enjoy peace of mind knowing you're backed by NXP's trusted expertise—empowering you to achieve superior results every time!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance and higher efficiency than P-channel FETs due to their lower on-resistance, making this product a strong choice for power applications.

Configuration: SINGLE

A single configuration simplifies design and integration into circuits, making it easier to work with and implement in various applications.

Surface Mount: YES

Surface mount technology allows for smaller and more compact circuit designs, helping to save space on PCBs while facilitating automated assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides higher efficiency and better switching characteristics, suitable for modern power management solutions.

Maximum Drain Current (Abs) (ID): 33 A

A maximum drain current of 33A allows for handling high power loads, making this FET ideal for demanding applications in power electronics.

Maximum Power Dissipation (Abs): 26 W

With a power dissipation of 26W, this transistor can handle heat effectively, ensuring reliable operation even under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high efficiency with fast switching capabilities, resulting in lower energy losses during operation.

Maximum Operating Temperature: 175 °C

A high operating temperature range of 175 °C means this FET can function reliably in harsh environments, making it versatile for various applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and oxidation resistance, ensuring reliable connections in applications.

Maximum Drain Current (ID): 33 A (duplicate)

Reiterating the capability of handling high currents, this specification ensures robustness and suitability for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds helps ensure solder joints are adequately formed without damaging the component, enhancing assembly reliability.

Peak Reflow Temperature °C: 260

A reflow temperature of 260 °C allows the FET to withstand the soldering process in automated assembly while maintaining its integrity and performance.

Technical Specifications

Power Field Effect Transistors (FET) PSMN012-25YLC,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

33 A

Maximum Drain Current (ID):

33 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PSMN012-25YLC,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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